现行

BS 123600-2001

System of quality assessment. Sectional specification. Flex-rigid multilayer printed boards with through-connections
质量评估体系 分规范 带贯穿连接的软硬多层印制板

2001-12-17

现行

BS 123300-003-2001

System of quality assessment. Capability detail specification. Rigid multilayer printed boards
质量评估体系 能力详细说明 刚性多层印制板

2001-12-17

现行

BS EN 123600-1997

Harmonized system of quality assessment for electronic components. Sectional specification. Flex-rigid multilayer printed boards with through connections
电子元件质量评定协调体系 分规范 带贯穿连接的软硬多层印制板

1997-05-15

现行

BS 123800-2001

System of quality assessment. Sectional specification. Flexible multilayer printed boards with through-connections
质量评估体系 分规范 具有贯穿连接的挠性多层印制板

2001-12-17

现行

BS EN 123300-1992

Specification for harmonized system of quality assessment for electronic components. Sectional specification. Multilayer printed boards
电子元件质量评定协调体系规范 分规范 多层印制板

1989-08-31

现行

BS 123600-003-2001

System of quality assessment. Capability detail specification. Flex-rigid multilayer printed boards with through-connections
质量评估体系 能力详细说明 带贯穿连接的软硬多层印制板

2001-12-17

现行

DIN 45910-19

Harmonized system of quality assessment for electronic components; sectional specification: fixed multilayer ceramic chip capacitors
电子元件质量评定协调体系；分规范:多层陶瓷片式固定电容器

1991-02-01

现行

BS EN 123800-1997

Harmonized system of quality assessment for electronic components. Sectional specification. Flexible multilayer printed boards with through connections
电子元件质量评定协调体系 分规范 具有贯穿连接的挠性多层印制板

1997-05-15

现行

BS 123700-2001

System of quality assessment. Sectional specification. Flex-rigid double-sided printed boards with through-connections
质量评估体系 分规范 带贯穿连接的挠性刚性双面印制板

2001-12-17

现行

BS 123200-2001

System of quality assessment. Sectional specification. Rigid double-sided printed boards with plated-through holes
质量评估体系 分规范 带电镀通孔的刚性双面印制板

2001-12-17

现行

BS CECC 23600-801-1998

Harmonized system of quality assessment for electronic components. Capability detail specification: flex-rigid multilayer printed boards with through connections
电子元件质量评定协调体系 能力详细规范:带贯穿连接的挠性-刚性多层印制板

1998-06-15

现行

BS 123100-2001

System of quality assessment. Sectional specification. Rigid single-sided and double-sided printed boards with plain holes
质量评估体系 分规范 带普通孔的刚性单面和双面印制板

2001-12-17

现行

BS EN 147100-1995

Harmonized system of quality assessment for electronic components. Sectional specification: relay sockets of assessed quality
电子元件质量评定协调体系 分规范:经质量评定的继电器插座

1995-01-15

现行

BS EN 123700-1997

Harmonized system of quality assessment for electronic components. Sectional specification. Flex-rigid double sided printed boards with through connections
电子元件质量评定协调体系 分规范 带贯穿连接的刚柔双面印制板

1997-05-15

现行

BS 123800-003-2001

System of quality assessment. Capability detail specification. Flexible multilayer printed boards with through-connections
质量评估体系 能力详细说明 具有贯穿连接的挠性多层印制板

2001-12-17

现行

BS CECC 23300-003-1996

Harmonized system of quality assessment for electronic components. Capability detail specification: multilayer printed boards
电子元件质量评定协调体系 能力详细规范:多层印制板

1996-04-15

现行

BS EN 175200-1997

Harmonized system of quality assessment for electronic components. Sectional specification: circular connectors
电子元件质量评定协调体系 分规范:圆形连接器

1997-04-15

现行

DIN 45922-12

Harmonized system of quality assessment for electronic components; sectional specification: power potentiometers
电子元件质量评定协调体系；分规范:功率电位计

1979-12-01

现行

BS EN 160100-1998

Harmonized system of quality assessment for electronic components. Sectional specification: capability approval of manufacturers of printed board assemblies of assessed quality
电子元件质量评定协调体系 分规范:经质量评估的印制板组件制造商的能力批准

1998-02-15

现行

BS CECC 41400-1980

Harmonized system of quality assessment for electronic components: sectional specification: rotary precision potentiometers
电子元件质量评定协调体系:分规范:旋转精密电位器

1980-02-29