现行

YS/T 641-2007

半导体器件键合用铝丝
Aluminium wire for semiconductor lead bonding

2007-04-13

现行

ASTM F72-24

Standard Specification for Gold Wire for Semiconductor Lead Bonding
半导体引线键合用金线的标准规范

2024-04-01

现行

GB/T 34507-2017

封装键合用镀钯铜丝
Palladium coated copper bonding wire for semiconductor package

2017-10-14

现行

SJ/T 10705-1996

半导体器件键合丝表面质量检验方法
Standard practice for inspection of surface quality of semiconductor lead-bonding wire

1996-07-22

现行

YS/T 543-2015

半导体键合用铝-1%硅细丝
Standard specification for fine aluminum-1% silicon wire for semiconductor lead-bonding

2015-04-30

现行

SJ/T 10626-1995

键合金丝中微量杂质的ICP发射光谱分析方法
Method for determining impurities in gold wire for semiconductor lead bonding by ICP-AES

1995-04-22

现行

YS/T 1105-2016

半导体封装用键合银丝
Silver bonding wire for semiconductor package

2016-04-05

现行

GOST 22301-1977

Провода медные обмоточные с термореактивным связующим. Технические условия
铜绕组线 具有阳离子键合 规格

现行

GB/T 8750-2022

半导体封装用金基键合丝、带
Gold-based bonding wire and bandlet for semiconductor package

2022-12-30

现行

KS D 5601(2021 Confirm)

주석 또는 주석-납합금 도금 동선
镀锡或锡铅铜线

2016-12-19

现行

KS D 5601

주석 또는 주석-납합금 도금 동선
锡或锡铅镀铜线

2016-12-19

现行

GB/T 34502-2017

封装键合用镀金银及银合金丝
Gold-coated silver and silver alloy bonding wires for semiconductor package

2017-09-29

现行

BS 4799-1-1972

Specification for varnish-bonded glass-lapped copper conductors-Round wire
清漆粘合玻璃搭接铜导线规范 圆线

1972-05-25

现行

ASTM B189-05(2021)

Standard Specification for Lead-Coated and Lead-Alloy-Coated Soft Copper Wire for Electrical Purposes
电气用铅涂层和铅合金涂层软铜线的标准规范

2021-10-01

现行

ASTM B470-02(2024)

Standard Specification for Bonded Copper Conductors for Use in Hookup Wires for Electronic Equipment
用于电子设备连接线的粘合铜导体的标准规范

2024-10-01

现行

BS EN 60317-37-2014

Specifications for particular types of winding wires-Polyesterimide enamelled round copper wire, class 180, with a bonding layer
特殊类型绕组线规范

2014-02-28

现行

BS EN 60317-2-2012

Specifications for particular types of winding wires-Solderable polyurethane enamelled round copper wire, class 130, with a bonding layer
特殊类型绕组线规范

2012-11-30

现行

BS EN IEC 60317-80-2019

Specifications for particular types of winding wires-Polyvinyl acetal enamelled rectangular copper wire, class 120, with a bonding layer
特殊类型绕组线规范

2019-10-29

现行

BS EN 60317-35-2014+A1-2019

Specifications for particular types of winding wires-Solderable polyurethane enamelled round copper wire, class 155, with a bonding layer
特殊类型绕组线规范

2019-10-28

现行

BS EN 60317-36-2014+A1-2019

Specifications for particular types of winding wires-Solderable polyesterimide enamelled round copper wire, class 180, with a bonding layer
特殊类型绕组线规范

2019-10-25