半导体器件 第16-5部分：微波集成电路 振荡器
Semiconductor devices—Part 16-5: Microwave integrated circuits—Oscillators

2023-09-07

Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators
半导体器件 - 第16-5部分:微波集成电路 - 振荡器

2013-06-19

Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators
半导体器件.第16-5部分:微波集成电路.振荡器

2020-07-14

BS EN 60747-16-5. Semiconductor devices. Part 16-5. Microwave integrated circuits. Oscillators
英国标准EN 60747-16-5 半导体器件 第16-5部分 微波集成电路 振荡器

2008-12-18

Amendment 1 - Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators
修改件1.半导体器件.第16-5部分:微波集成电路.振荡器

2020-07-14

Draft Document - Semiconductor devices - Part 16-7: Microwave integrated circuits - Attenuators (IEC 47E/734/CD:2020); Text in English
文件草案-半导体器件-第16-7部分:微波集成电路-衰减器（IEC 47E/734/CD:2020）；英文文本

2021-07-01

Draft Document - Semiconductor devices - Part 16-8: Microwave integrated circuits - Limiters (IEC 47E/735/CD:2020); Text in English
文件草案-半导体器件-第16-8部分:微波集成电路-限制器（IEC 47E/735/CD:2020）；英文文本

2021-07-01

Draft Document - Semiconductor devices - Part 16-9: Microwave integrated circuits - Phase shifters (IEC 47E/768/CD:2021); Text in German and English
文件草案.半导体器件.第16-9部分:微波集成电路.移相器（IEC 47E/768/CD:2021）；德语和英语文本

2022-06-01

Draft Document - Semiconductor devices - Discrete devices - Part 4: Microwave diodes and transistors (IEC 47E/265/CD:2004)
文件草案.半导体器件.分立器件.第4部分:微波二极管和晶体管（IEC 47E/265/CD:2004）

2005-01-01

Draft Document - Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor (IEC 47E/353/CD:2007)
文件草稿-半导体器件-第14-5部分:半导体传感器-PN结半导体温度传感器（IEC 47E/353/CD:2007）

2008-03-01

Draft Document - Semiconductor devices - Discrete devices - Part 5-7: Optoelectronic devices - Photodiodes and phototransistors (IEC 47E/420/CD:2011)
文件草案-半导体器件-分立器件-第5-7部分:光电子器件-光电二极管和光电晶体管（IEC 47E/420/CD:2011）

2011-12-01

Draft Document - Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS Switches (IEC 47/1928/CD:2007)
文件草稿.半导体器件.微机电器件.第5部分:RF MEMS开关（IEC 47/1928/CD:2007）

2008-02-01

Draft Document - Semiconductor devices - Discrete devices - Part 5-6: Optoelectronic devices - Light emitting diodes (IEC 47E/418/CD:2011)
文件草案-半导体器件-分立器件-第5-6部分:光电子器件-发光二极管（IEC 47E/418/CD:2011）

2011-12-01

Draft Document - Changes for IEC 60747-5-2:1997 + A1:2002; Discrete semiconductor devices and integrated circuits - Part 5-2: Optoelectronic devices; Essential ratings and characteristics
文件草案——IEC 60747-5-2:1997+A1:2002的变更；分立半导体器件和集成电路.第5-2部分:光电子器件；基本评级和特征

2002-11-01

Draft Document - Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA (IEC 47D/835/CD:2013)
文件草案.半导体器件的机械标准化.第6-16部分:BGA LGA FBGA和FLGA用半导体试验和老化插座术语表（IEC 47D/835/CD:2013）

2013-08-01

Draft Document - Passive r.f. and microwave devices, intermodulation level measurement - Part 5: Measurement of passive intermodulation in filters (IEC 46/229/CD:2007)
文件草案.无源射频和微波器件互调电平测量.第5部分:滤波器中无源互调的测量（IEC 46/229/CD:2007）

2007-08-01

Draft Document - Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA) (IEC 47D/755/CD:2009)
文件草案.半导体器件的机械标准化.第6-5部分:表面安装半导体器件封装外形图绘制的一般规则.细间距球栅阵列（FBGA）的设计指南（IEC 47D/755/CD:2009）

2010-01-01