IEC？61190-1-3:20 17规定了电子级焊料合金、助焊剂和非助焊剂棒、带、粉末焊料和焊膏、电子焊接应用和“特殊”电子级焊料的要求和测试方法。有关焊料合金和助焊剂的通用规格，请参见ISO？9453.本文件为质量控制文件，并不打算直接涉及材料在生产过程中的性能。 与上一版相比，此版本包括以下重大技术变更: A）？Pb的最大杂质水平已经修订，无铅焊料合金表包括一些额外的无铅焊料合金。

IEC？61190-1-3:2017 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO？9453. This document is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process.
This edition includes the following significant technical changes with respect to the previous edition:
a)？The maximum impurity level of Pb has been revised and the table of lead free solder alloys includes some additional lead free solder alloys.