感应固化粘合剂的发展创造了许多明显的优势，超过了传统的基板连接方法。本文将研究这些优点，简要描述感应加热背后的物理原理，介绍该技术的正确应用，描述设备选择的基础，并研究一致结果所需的控制技术，包括温度监测系统、感应线圈设计参数、电源考虑和其他系统控制。

THE DEVELOPMENT OF INDUCTION CURABLE ADHESIVES HAS CREATED A NUMBER OF DISTINCT BENEFITS OVER TRADITIONAL METHODS OF JOINING SUBSTRATES. THIS PAPER WILL EXAMINE THOSE BENEFITS, BRIEFLY DESCRIBE THE PHYSICS BEHIND INDUCTION HEATING, PRESENT PROPER APPLICATIONS OF THE TECHNOLOGY, DESCRIBE FOUNDATIONS FOR SELECTION OF EQUIPMENT, AND EXAMINE CONTROL TECHNIQUES REQUIRED FOR CONSISTENT RESULTS INCLUDING TEMPERATURE MONITORING SYSTEMS, INDUCTION COIL DESIGN PARAMETERS, POWER SUPPLY CONSIDERATIONS AND OTHER SYSTEM CONTROLS.