本文回顾了PCB和测试夹具的设计标准，以及影响测试探针接触的关键装配工艺参数。通过一系列设计实验，探讨了这些因素的意义。总之，本文提出了一套设计和工艺建议，为无清洁工艺的锡膏过孔提供最佳的测试探针接触。

This paper reviews the PCB and test fixture design criteria, along with key assembly process parameters that affect test probe contact. Through a series of designed experiments, the significance of these factors are investigated. In conclusion, a set of design and process recommendations are presented that provide optimum test probe contact for solder paste vias with a no-clean process.