Non-conductive coatings on non-magnetic electrically conductive base metals. Measurement of coating thickness. Amplitude-sensitive eddy-current method
非磁性导电基底金属上的非导电涂层 涂层厚度的测量 振幅敏感涡流法

2017-09-15

Non-conductive coatings on non-magnetic electrically conductive base metals — Measurement of coating thickness — Amplitude-sensitive eddy-current method
非磁性导电基底金属上的非导电涂层 - 涂层厚度测量 - 幅度敏感型涡流法

2017-07-25

非磁性基体金属上非导电覆盖层 覆盖层厚度测量 涡流法
Non-conductive coatings on non-magnetic basis metals--Measurement of coating thickness--Eddy current

2003-10-29

Non-conductive coatings on non-magnetic electrically conductive basis materials - Measurement of coating thickness - Amplitude-sensitive eddy current method (ISO 2360:2003)
非磁性导电基材上的非导电涂层涂层厚度的测量振幅敏感涡流法

2004-06-25

비자성 소지 위의 비전도성 피막 - 피막두께 시험방법 - 진폭 민감형 와전류 방법
非磁性基体金属上的非导电涂层涂层厚度的测量振幅敏感涡流法

2002-07-25

비자성 소지 위의 비전도성 피막 - 피막두께 시험방법 - 진폭 민감형 와전류 방법
非磁性基底金属上的非导电涂层涂层厚度的测量振幅敏感涡流法

2002-07-25

Thermal spraying. Measurement of the electrical conductivity of thermal sprayed non-iron metal coatings by means of eddy current method
热喷涂 用涡流法测量热喷涂非铁金属涂层的电导率

2016-11-30

Materials for printed boards and other interconnecting structures-Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.5W/m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
印制板和其他互连结构用材料

2018-04-16

Materials for printed boards and other interconnecting structures-Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.0W/m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
印制板和其他互连结构用材料

2018-04-13

Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,5 W/(m？K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
印制板和其他互连结构材料.第2-46部分:包覆和非包覆增强基材.无铅组件用导热系数为1.5W/（m？K）和规定可燃性（垂直燃烧试验）的非卤化环氧化物无纺/编织E玻璃增强层压板

2018-01-10

Materials for printed boards and other interconnecting structures - Part 2-45: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m？K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
印制板和其他互连结构用材料.第2-45部分:包层和非包层增强基材.无铅组装用包铜导热系数为1.0W/（m？K）和规定可燃性（垂直燃烧试验）的非卤化环氧无纺/编织E玻璃增强层压板

2018-01-10

Materials for printed boards and other interconnecting structures - Part 2-47: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2,0 W/(m？K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
印制板和其他互连结构材料.第2-47部分:包覆和非包覆增强基材.无铅组件用导热系数为2.0W/（m？K）和规定可燃性（垂直燃烧试验）的非卤化环氧化物无纺/编织E玻璃增强层压板

2018-01-10