本通用标准适用于要求设备和装置符合公制模块顺序的所有电子领域。本标准规定了平行安装、互连电子电路组件（以下简称夹层卡）的公制模块顺序，并可应用于其他应用。机械结构协调尺寸的选择在IEC 917.2-1992中规定的、IEEE Std 1301-1991中引用的均匀、公制、模块化三维网格内。因此，在整个设计和制造过程中，为计算机辅助方法的应用创造了最佳条件，例如，计算机辅助规划、开发、制造、测试，和安装。 由于夹层卡的特定应用性质，电气和机械互连实施将需要超出本文件范围的定义。

This generic standard may be applied in all fields of electronics where equipment and installations are required to conform to a metric modular order. This standard establishes the metric modular order for parallel mounted, interconnected electronic circuit assemblies, hereafter referred to as mezzanine cards, and may be applied in other applications. The choice of coordination dimensions for the mechanical structure lies within a homogeneous, metric, modular, three-dimensional grid as specified in IEC 917.2-1992 and referenced in IEEE Std 1301-1991.1 Optimum conditions are thereby created for the application of computer-assisted methods throughout design and manufacturing, e.g., computer-assisted planning, development, manufacturing, testing, and installation. Due to the application-specific nature of mezzanine cards, the electrical and mechanical interconnect implementation will require definition that is beyond the scope of this document.