IPC-4554《印刷电路板浸没镀锡规范》包含在IPC-455X系列规范中，该系列规范规定了印刷电路板表面光洁度的要求，可替代非共面光洁度，通常称为锡铅HASL光洁度。本规范为全彩文件，供供应商或印制板制造商、电镀化学供应商、合同装配商或EMS设施以及原始设备制造商（OEM）使用。浸没锡（Sn）是一种通过化学置换反应沉积的金属表面处理剂，直接应用于印制板的基体金属，即铜。浸没锡主要用作部件连接的可焊表面。当采用压配合连接时，也可使用该接头，并用于零插入力（ZIF）边缘连接器。在IPC/EIA J中所述的涂层的预期保质期内，浸没锡涂层保护底层铜免受氧化- STD-003作为3类涂层耐久性饰面（储存期超过六个月）。插入的修改件1提供了关于浸入式锡的可焊性的更多细节，使用锡铅以及使用适当焊剂的“无铅”焊料。

IPC-4554, Specification for Immersion Tin Plating for Printed Circuit Boards, is included in the IPC-455X series of specifications that set the requirements for printed board surface finishes that are alternates to non-coplanar finishes, most often referred to as tin-lead HASL finish. This specification is a full-color document that is intended for use by the supplier or printed board fabricator, plating chemistry supplier, contract assembler or EMS facility and the original equipment manufacturer (OEM). The immersion tin (Sn) is a metallic finish deposited by a chemical displacement reaction that is applied directly to the basis metal of the printed board, which is copper. The immersion tin is primarily used as a solderable surface for attachment of components. It may also be used when press fit connections are employed and for zero insertion force (ZIF) edge connectors. The immersion tin finish protects the underlying copper from oxidation over the intended shelf life of this finish that is described in IPC/EIA J-STD-003 as a Category 3 coating durability finish (storage of greater than six months). The inserted Amendment 1 provides more detail on the solderability of the immersion tin, using both tin-lead as well as "lead-free" solders using appropriate fluxes.