IEC？60191-1:20 18（E）给出了分立器件轮廓图编制指南，包括引线数小于8的分立表面贴装半导体器件。 与上一版相比，此版本包括以下重大技术变更: a)范围已经扩展到包括引线计数小于8的表面安装半导体器件； b)增加了术语“立足点”的定义； c)用于定位基准的方法已经扩展到适用于SMD封装； d)明确了用于自动处理的终端位置一的视觉识别； e)明确了终端的绘制规则； f)表A.1已经用专门用于SMD封装的符号完成； g)删除了附件B“标准化理念”；h)增加了带有SMD封装特殊规则的规范性附件； i)半导体器件附图的示例已经与包括SMD封装的现有技术封装对齐。

IEC？60191-1:2018(E) gives guidelines on the preparation of outline drawings of discrete devices, including discrete surface-mounted semiconductor devices with lead count less than 8.
This edition includes the following significant technical changes with respect to the previous edition:
a) the Scope has been extended to include surface-mounted semiconductor devices with a lead count less than 8;
b) a definition of the term "stand-off" has been added;
c) the methods for locating the datum have been extended to be suitable for SMD-packages;
d) the visual identification of terminal position one for automatic handling has been clarified;
e) the rules for the drawing of terminals have been clarified;
f) Table A.1 has been completed with symbols specifically for SMD-packages;
g) Annex B "Standardization philosophy" has been deleted;
h) a normative Annex with special rules for SMD-packages has been added;
i) the examples of semiconductor device drawings have been aligned to state-of-the-art packages including SMD-packages.