BS 9612 N009:1977-振荡器用冷焊密封石英晶体元件详细规范 DN、DQ和DP外壳频率范围为50至125 MHz 第五泛音厚度剪切模式切割时用于窄温度范围内的操作（温度控制）全面评估水平-国家数字标准馆

现行 BS 9612 N009:1977

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Detail specification for cold welded seal quartz crystal units for oscillator applications. DN, DQ and DP enclosures, 50 to 125 MHz frequency range. Fifth overtone thickness-shear mode, AT-cut, for operation over narrow temperature ranges (temperature controlled). Full assessment level 振荡器用冷焊密封石英晶体元件详细规范 DN、DQ和DP外壳频率范围为50至125 MHz 第五泛音厚度剪切模式切割时用于窄温度范围内的操作（温度控制）全面评估水平

发布日期： 1977-06-15

额定值、特性和检验要求。交叉引用:BS 2011BS 5069:第1BS 6001BS 9000BS 9610PD 9002部分

Ratings, characteristics and inspection requirements.Cross References:BS 2011BS 5069:Part 1BS 6001BS 9000BS 9610PD 9002

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发布单位或类别：英国-英国标准学会

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振荡器用冷焊密封石英晶体元件详细规范 DK外壳频率范围为6.0至25 MHz 基本厚度剪切模式切割时适用于宽温度范围（非温度控制）的操作全面评估水平

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振荡器用冷焊密封石英晶体元件详细规范 DN、DQ和DP外壳 17至75 MHz频率范围第三泛音厚度剪切模式切割时用于窄温度范围内的操作（温度控制）全面评估水平

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BS 9612 N008-1977

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振荡器用冷焊密封石英晶体元件详细规范 DN、DQ和DP外壳频率范围为50至125 MHz 第五泛音厚度剪切模式切割时适用于宽温度范围（非温度控制）的操作全面评估水平

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振荡器用电阻焊接密封石英晶体元件详细规范 DN、DZ、DQ和DP外壳频率范围为50至125 MHz 第五泛音厚度剪切模式切割时用于窄温度范围内的操作（温度控制）全面评估水平

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BS 9612 N019-1979

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振荡器用电阻焊接密封石英晶体元件详细规范 DN、DZ、DQ和DP外壳频率范围为17至75 MHz 第三泛音厚度剪切模式切割时用于窄温度范围内的操作（温度控制）全面评估水平

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现行

BS 9612 N020-1979

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现行

BS 9612 N018-1979

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振荡器用电阻焊接密封石英晶体元件详细规范 DN、DZ、DQ和DP外壳频率范围为17至75 MHz 第三泛音厚度剪切模式切割时用于宽温度范围（非温度控制）的操作全面评估水平

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现行

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现行

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