随着微机械设备和系统的发展，加工能力和多样性不断增加。过去，作为半导体工业的产物，微机械是通过硅的光刻和蚀刻来制造的。虽然这一工艺仍然是微传感器技术的支柱，但已经开发出许多其他工艺，利用各种材料、尺寸和机械和机电部件的纵横比。这些工艺包括深x射线光刻、微电铸、通过微注塑和热压在塑料中复制、激光烧蚀和光聚合，以及直接微机械加工技术。

As the development of micro-mechanical devices and systems advances, process capabilities and diversity are increasing. In the past, micro-machines were fabricated by lithography and etching of silicon, as an outgrowth of the semiconductor industry. While this process remains the backbone of micro-sensor technology, many other processes have been developed which utilize a wide variety of materials, dimensions, and aspect ratios for mechanical and electromechanical components. Examples of these processes include deep x-ray lithography, micro-electroforming, replication in plastics by micro-injection molding and hot embossing, laser ablation and photopolymerization, and direct micro-mechanical machining techniques.