印制板用E玻璃纤维布
E-glass fabric woven for printed boards

2013-11-27

인쇄 회로 기판 재료－제2부：규격－ 제11장：다층 인쇄 회로 기판 제조용 일반 등급의 박막 에폭시 유리 섬유 직물 동 입힘 적층판
印制电路用基材第2部分:第11号规范:多层印制板制造用通用级薄环氧玻璃纤维布覆铜层压板

2002-08-31

印制电路板用低介电玻璃纤维布热处理后白度的测定

2024-06-07

Base materials for printed circuits -- Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed board
印制电路用基材多层印制板制造用规定可燃性的薄型聚酰亚胺编织玻璃纤维覆铜层压板

1999-01-01

Base materials for printed circuits -- Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
印制电路用基材多层印制板制造用规定可燃性的双马来酰亚胺/三嗪改性环氧玻璃纤维织物覆铜薄层压板

1999-01-01

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 12: THIN EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY, FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.
印刷电路的基材 第2部分:规范 规范12:多层印制板制造用规定可燃性的薄环氧玻璃纤维织物覆铜层压板

1996-07-24

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 17: THIN POLYIMIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARD.
印刷电路的基材 第2部分:规范 规范Nº17:多层印制板制造用规定可燃性的薄聚酰亚胺编织玻璃纤维覆铜层压板

1997-08-11

인쇄 회로 기판 및 기타 연결 구조 재료－제2-21부：동박 및 무동박 보강재－직조 E－유리섬유 기재 무할로겐 에폭시 수지 동박 적층판,난연성(수직 연소 시험)
印制板和其他互连结构用材料第2-21部分:覆层和非覆层增强基材规定可燃性的非卤化环氧编织E玻璃纤维增强覆铜板（垂直燃烧试验）

2006-12-26

Materials for printed boards and other interconnecting structures-Reinforced base materials, clad and unclad-Brominated epoxide non-woven/woven E-glass glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
印制板和其他互连结构用材料 加固基材 包覆和未包覆 规定可燃性的包铜溴化环氧无纺/编织E玻璃纤维增强层压板（垂直燃烧试验）

2006-08-31

Materials for printed boards and other interconnecting structures-Reinforced base materials, clad and unclad-Polyimide, brominated epoxide modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
印制板和其他互连结构用材料 加固基材 包覆和未包覆 规定可燃性（垂直燃烧试验）的溴化环氧改性或未改性聚酰亚胺E玻璃纤维增强覆铜板

2004-02-19

인쇄 회로 기판 및 기타 연결 구조 재료－제2-21부：동박 및 무동박 보강재－직조 E－유리섬유 기재 무할로겐 에폭시 수지 동박 적층판,난연성(수직 연소 시험)
印制板和其他互连结构用材料第2-21部分:包覆和非包覆增强基材规定可燃性的非卤化环氧编织E玻璃纤维增强覆铜板（垂直燃烧试验）

2006-12-26

인쇄기판용 재료 및 기타 상호접속구조－제2－6부：동박적층난연등급 (수직연소시험)의 유리섬유 직조 및 비직조 브롬강화 에폭시 재료
印制板和其他互连结构用材料第2-6部分:覆层和非覆层增强基材规定可燃性的溴化环氧无纺/编织E玻璃纤维增强覆铜板（垂直燃烧试验）

2009-12-01

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 19: THIN BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.
印刷电路的基材 第2部分:规范 规范19:多层印制板制造用规定可燃性的双马来酰亚胺/三嗪改性环氧编织玻璃纤维覆铜薄层压板

1997-08-11

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 19: THIN BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.
印刷电路的基材 第2部分:规范 规范19:多层印制板制造用规定可燃性的双马来酰亚胺/三嗪改性环氧编织玻璃纤维覆铜薄层压板

1997-10-17

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 19: THIN BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.
印刷电路的基材 第2部分:规范 规范19:多层印制板制造用规定可燃性的双马来酰亚胺/三嗪改性环氧编织玻璃纤维覆铜薄层压板

1997-10-17

인쇄기판용 재료 및 기타 상호접속구조－제2－5부：동박적층난연등급(수직연소시험)의 표면 유리섬유 직조 및 브롬강화 에폭시 셀룰로스지 재료
印制板和其他互连结构用材料第2-5部分:覆层和非覆层增强基材溴化环氧纤维素纸增强芯/编织E玻璃纤维增强表面覆铜箔规定可燃性层压板（垂直燃烧试验）

2009-12-01

Materials for printed boards and other interconnecting structures -- Part 2-9: Reinforced base materials clad and unclad - Bismaleimide/triazine, modified epoxide or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
印制板和其他互连结构用材料第2-9部分:包覆和未包覆增强基材覆铜双马来酰亚胺/三嗪改性环氧或未改性编织E玻璃纤维增强层压板

2004-06-11

Materials for printed boards and other interconnecting structures - Part 2-41: Reinforced base materials clad and unclad - Brominated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
印制板和其他互连结构用材料 - 第2-41部分:包层和非包层增强基层材料 - 溴化环氧纤维素纸/编织E型玻璃纤维增​​强层压板 规定易燃性（垂直燃烧测试） 无铅组装铜包层

2010-04-21

Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-43:2016); German version EN 61249-2-43:2016
印制板和其他互连结构用材料.第2-43部分:包覆和未包覆的增强基材.无铅组装用规定可燃性的包铜非卤化环氧纤维素纸/编织E玻璃纤维增强层压板（垂直燃烧试验）（IEC 61249-2）

2017-03-01

인쇄 회로 기판 및 기타 연결 구조 재료－제2－11부：동박 및 무동박 보강재－직조 E-유리 섬유 기재 폴리이미드 수지 및 변성 또는 무변성 브롬화 에폭시 수지 동박 적층판,난연성(수직 연소 시험)
印制板和其他互连结构用材料第2－11部分:包覆和未包覆增强基材规定可燃性的聚酰亚胺溴化环氧改性或未改性编织E玻璃纤维增强覆铜板（垂直燃烧试验）

2006-12-26