现行

BS 6221-11-1991

Printed wiring boards-Specification for flex-rigid multilayer printed boards with through connections
印刷线路板 带贯穿连接的挠性-刚性多层印制板规范

1991-08-30

现行

MIL MIL-PRF-31032/4B Amendment 2

Printed Wiring Board, Rigid Flex or Flexible, Multilayer, with Plated-Through Holes, with or without Stiffeners, for Soldered Part Mounting
焊接零件安装用带或不带加强件的镀通孔的刚性-柔性或柔性多层印刷线路板

2013-06-24

现行

MIL MIL-PRF-31032/4A Amendment 4

Printed Wiring Board, Rigid Flex or Flexible, Multilayer, with Plated-Through Holes, with or without Stiffeners, for Soldered Part Mounting
焊接零件安装用带或不带加强件的镀通孔的刚性-柔性或柔性多层印刷线路板

2009-06-10

现行

MIL MIL-PRF-31032/4B Amendment 1

Printed Wiring Board, Rigid Flex or Flexible, Multilayer, with Plated-Through Holes, with or without Stiffeners, for Soldered Part Mounting
焊接零件安装用带或不带加强件的镀通孔的刚性-柔性或柔性多层印刷线路板

2012-11-04

现行

MIL MIL-PRF-31032/4C Amendment 2

Printed Wiring Board, Rigid Flex or Flexible, Multilayer, with Plated-Through Holes, with or without Stiffeners, for Soldered Part Mounting
焊接零件安装用带或不带加强件的镀通孔的刚性-柔性或柔性多层印刷线路板

2018-07-14

现行

MIL MIL-PRF-31032/4C Amendment 1

Printed Wiring Board, Rigid Flex or Flexible, Multilayer, with Plated-Through Holes, with or without Stiffeners, for Soldered Part Mounting
焊接零件安装用带或不带加强件的镀通孔的刚性-柔性或柔性多层印刷线路板

2018-01-08

现行

MIL MIL-PRF-31032/4D

Printed Wiring Board, Rigid Flex or Flexible, Multilayer, with Plated-Through Holes, with or without Stiffeners, for Soldered Part Mounting
多层印刷线路板 刚柔 带电镀通孔 带或不带加强筋 用于焊接部件安装

2020-04-04

现行

MIL MIL-PRF-50884G

Printed Wiring Board, Flexible or Rigid-Flex, General Specification for
柔性或刚性柔性印刷线路板通用规范

2020-07-28

现行

MIL MIL-PRF-31032/4A Amendment 1

PRINTED WIRING BOARD, RIGID FLEX OR FLEXIBLE, MULTILAYER, WITH PLATED HOLES, WITH OR WITHOUT STIFFENERS, FOR SOLDERED PART MOUNTING (SUPERSEDING MIL-PRF-31032/4)
打印接线板 刚性柔性或柔性多层 带有孔的 具有或不具有强度的 用于焊接的部件安装（取代MIL-PRF-31032/4）

2006-02-24

现行

MIL MIL-PRF-31032/4A Amendment 2

PRINTED WIRING BOARD, RIGID FLEX OR FLEXIBLE, MULTILAYER, WITH PLATED HOLES, WITH OR WITHOUT STIFFENERS, FOR SOLDERED PART MOUNTING (SUPERSEDING MIL-PRF-31032/4)
焊接部件安装用刚性-柔性或柔性多层印制线路板 带镀层孔 带或不带加强件（代替MIL-PRF-31032/4）

2006-11-28

现行

QPL QPL-50884-59

PRINTED WIRING BOARD, FLEXIBLE OR RIGID-FLEX, GENERAL SPECIFICATION FOR(SUPERSEDING QPL-50884-58)
挠性或硬挠性印制线路板通用规范（代替QPL-50884-58）

2006-12-26

现行

MIL MIL-P-50884E Notice 3-Amendment 3

PRINTED WIRING BOARD, FLEXIBLE OR RIGID-FLEX GENERAL SPECIFICATION FOR (SUPERSEDING MIL-P-50884D)
柔性或硬柔性印刷线路板通用规范（代替MIL-P-50884D）

2010-09-01

现行

MIL MIL-P-50884E Notice 1-Amendment 1

PRINTED WIRING BOARD, FLEXIBLE OR RIGID-FLEX GENERAL SPECIFICATION FOR (SUPERSEDING MIL-P-50884D)
柔性或硬柔性印刷线路板通用规范（代替MIL-P-50884D）

2009-07-03

现行

MIL MIL-P-50884D Notice 1-Amendment 1

PRINTED WIRING BOARD, FLEXIBLE OR RIGID-FLEX GENERAL SPECIFICATION FOR (SUPERSEDING MIL-P-50884C)
柔性或硬柔性印刷线路板通用规范（代替MIL-P-50884C）

2002-09-13

现行

QPL QPL-50884-59

PRINTED WIRING BOARD, FLEXIBLE OR RIGID-FLEX, GENERAL SPECIFICATION FOR(SUPERSEDING QPL-50884-58)
挠性或硬挠性印制线路板通用规范（代替QPL-50884-58）

2006-12-26

现行

MIL MIL-P-50884D Notice 2-Amendment 2

PRINTED WIRING BOARD, FLEXIBLE OR RIGID-FLEX GENERAL SPECIFICATION FOR (SUPERSEDING MIL-P-50884C)
挠性或硬挠性印制电路板通用规范（代替MIL-P-50884C）

2006-05-29

现行

MIL MIL-PRF-31032/1C Amendment 1(amendment incorporated)

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting
印刷电路板 刚性 多层 热固性树脂基材 带或不带盲孔和埋地电镀通孔 用于焊接部件安装

2012-11-01

现行

MIL MIL-PRF-31032/1C Amendment 2(all prev amd incorp.)

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting
焊接部件安装用刚性多层热固性树脂基材印刷线路板 带或不带盲板和埋板通孔

2013-06-21

现行

MIL MIL-PRF-31032/5 Amendment 2(all prev amd incorp.)

Printed Wiring Board, Rigid, Multilayered, Thermoplastic, Thermosetting, or Thermoplastic and Thermosetting Resin Base Material, with Plated Through Holes, for High Frequency Applications
用于高频应用的带有镀通孔的刚性、多层、热塑性、热固性或热塑性和热固性树脂基材印刷线路板

2011-01-31

现行

MIL MIL-PRF-31032/1B Amendment 4(all prev amd incorp.)

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting
焊接部件安装用刚性多层热固性树脂基材印刷线路板 带或不带盲板和埋板通孔

2009-07-04