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IEC 60749-38 ED.1. Semiconductor devices mechanical and climatic test methods. Part 38. Soft error rate testing of electronic components IEC 60749-38第1版 半导体器件机械和气候试验方法 第38部分 电子元件的软错误率测试
发布日期: 2004-12-08
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发布单位或类别: 英国-英国标准学会
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现行
DIN EN 60749-38
Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory (IEC 60749-38:2008); German version EN 60749-38:2008
半导体器件.机械和气候试验方法.第38部分:带存储器的半导体器件的软误差试验方法(IEC 60749-38-2008);德文版EN 60749-38:2008
2008-10-01
现行
DIN EN 60749-1
Semiconductor devices - Mechanical and climatic test methods - Part 1: General (IEC 60749-1:2002 + Corr. 1:2003); German version EN 60749-1:2003
半导体器件机械和气候试验方法第1部分:总则;德文版EN 60749-1:2003
2003-12-01
现行
DIN EN 60749-10
Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock (IEC 60749-10:2002); German version EN 60749-10:2002
半导体器件.机械和气候试验方法.第10部分:机械冲击(IEC 60749-10-2002);德文版EN 60749-10:2002
2003-04-01
现行
DIN EN IEC 60749-13
Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere (IEC 60749-13:2018); German version EN IEC 60749-13:2018
半导体器件.机械和气候试验方法.第13部分:盐环境(IEC 60749-13-2018);德文版EN IEC 60749-13:2018
2018-10-01
现行
DIN EN IEC 60749-17
Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation (IEC 60749-17:2019); German version EN IEC 60749-17:2019
半导体器件.机械和气候试验方法.第17部分:中子辐照(IEC 60749-17-2019);德国版本EN IEC 60749-17:2019
2019-11-01
现行
DIN EN 60749-25
Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling (IEC 60749-25:2003); German version EN 60749-25:2003
半导体器件.机械和气候试验方法.第25部分:温度循环(IEC 60749-25-2003);德文版EN 60749-25:2003
2004-04-01
现行
DIN EN 60749-22
Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength (IEC 60749-22:200 + Corr. 1:2003); German version EN 60749-22:2003
半导体器件机械和气候试验方法第22部分:粘结强度;德文版EN 60749-22:2003
2003-12-01
现行
DIN EN IEC 60749-18
Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose) (IEC 60749-18:2019); German version EN IEC 60749-18:2019
半导体器件.机械和气候试验方法.第18部分:电离辐射(总剂量)(IEC 60749-18-2019);德国版本EN IEC 60749-18:2019
2020-02-01
现行
DIN EN 60749-42
Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage (IEC 60749-42:2014); German version EN 60749-42:2014
半导体器件.机械和气候试验方法.第42部分:温度和湿度存储(IEC 60749-42-2014);德文版EN 60749-42:2014
2015-05-01
现行
DIN EN 60749-2
Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure (IEC 60749-2:2002); German version EN 60749-2:2002
半导体器件.机械和气候试验方法.第2部分:低气压(IEC 60749-2-2002);德文版EN 60749-2:2002
2003-04-01
现行
DIN EN 60749-36
Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state (IEC 60749-36:2003); German version EN 60749-36:2003
半导体器件.机械和气候试验方法.第36部分:稳态加速度(IEC 60749-36-2003);德文版EN 60749-36:2003
2003-12-01
现行
DIN EN IEC 60749-15
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 60749-15:2020); German version EN IEC 60749-15:2020
半导体器件.机械和气候试验方法.第15部分:通孔安装器件的耐焊接温度(IEC 60749-15-2020);德国版本EN IEC 60749-15:2020
2022-05-01
现行
DIN EN 60749-14
Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity) (IEC 60749-14:2003); German version EN 60749-14:2003
半导体器件.机械和气候试验方法.第14部分:终端的坚固性(引线完整性)(IEC 60749-14-2003);德文版EN 60749-14:2003
2004-07-01
现行
DIN EN 60749-31
Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic encapsulated devices (internally induced) (IEC 60749-31:2002 + Corr. 1:2003); German version EN 60749-31:2003
半导体器件.机械和气候试验方法.第31部分:塑料封装器件(内部感应)的可燃性(IEC 60749-31-2002+Corr.1-2003);德文版EN 60749-31:2003
2003-12-01
现行
DIN EN 60749-8
Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing (IEC 60749-8:2002 + Corr. 1:2003 + Corr. 2:2003); German version EN 60749-8:2003
半导体器件机械和气候试验方法第8部分:密封;德文版EN 60749-8:2003
2003-12-01
现行
DIN EN 60749-44
Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices (IEC 60749-44:2016); German version EN 60749-44:2016
半导体器件.机械和气候试验方法.第44部分:半导体器件的中子束辐照单粒子效应(见)试验方法(IEC 60749-44-2016);德文版EN 60749-44:2016
2017-04-01
现行
DIN EN 60749-24
Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST (IEC 60749-24:2004); German version EN 60749-24:2004
半导体器件.机械和气候试验方法.第24部分:加速防潮.无偏HAST(IEC 60749-24-2004);德文版EN 60749-24:2004
2004-09-01
现行
DIN EN 60749-16
Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND) (IEC 60749-16:2003); German version EN 60749-16:2003
半导体器件.机械和气候试验方法.第16部分:颗粒碰撞噪声检测(PIND)(IEC 60749-16-2003);德文版EN 60749-16:2003
2003-09-01
现行
DIN EN 60749-33
Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave (IEC 60749-33:2004); German version EN 60749-33:2004
半导体器件.机械和气候试验方法.第33部分:加速防潮.无偏高压灭菌器(IEC 60749-33-2004);德文版EN 60749-33:2004
2004-09-01
现行
DIN EN 60749-37
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer (IEC 60749-37:2008); German version EN 60749-37:2008
半导体器件.机械和气候试验方法.第37部分:使用加速计的板级跌落试验方法(IEC 60749-37-2008);德语版本EN 60749-37:2008
2008-08-01