IPC-4552B标准规定了化学镀镍/浸金（ENIG）镀层厚度的要求，适用于焊接、引线键合和接触表面处理等应用。IPC-4552B标准用于规定验收标准，以满足IPC-6010系列文件（包括IPC-6012、IPC-6013和IPC-6018）的性能标准。使用本文件规定的ENIG镀层将符合IPC-J-STD-003印制板可焊性规范中规定的最高涂层耐久性等级。

IPC-4552B standard sets the requirements for Electroless Nickel / Immersion Gold (ENIG) deposit thickness for applications including soldering, wire bonding, and as a contact finish. IPC-4552B standard is used to specify acceptance criteria to meet performance standards for IPC-6010 family of documents including IPC-6012, IPC-6013 and IPC-6018. The ENIG deposit specified using this document will meet the highest coating durability rating as specified in IPC-J-STD-003 printed board solderability specification.