在单点金刚石磨料磨削实验和分析研究的基础上，提出了陶瓷磨削的材料去除模式。研究了陶瓷磨削过程中的表面裂纹、微塑性变形和再结晶。该模式被描述为三个区域:脆性断裂、非弹性变形和残余损伤。陶瓷磨削过程经历了弹性和有限微塑性变形、裂纹萌生和扩展以及切屑形成。

A material removal mode in ceramics grinding has been developed based on single-point diamond abrasive grinding experiments and analytical investigation. Surface cracks, micro-plastic deformation and recrystallization occurring in ceramics grinding have been studied. The mode has been described as three regions: brittle fracture, non-elastic deformation, and residual damages. The process of grinding ceramics experiences elastic and finitely micro-plastic deformation, crack initiation and propagation, and chip formation.