现行

GB/T 18373-2013

印制板用E玻璃纤维布
E-glass fabric woven for printed boards

2013-11-27

现行

GB/T 18373-2013

Finished fabric woven from E glass for printed boards

2013-09-27

现行

IPC 4412C

Specification for Finished Fabric Woven from "E" Glass for Printed Boards
印制板用“E”玻璃织成的成品织物规范

2021-09-01

现行

SJ/T 11283-2003

印刷板用处理"E"玻璃纤维布规范
Specification for finished fabric woven from"E" glass for printed boards

2003-06-04

现行

SJ 21286-2018

印制电路用玻璃纤维布规范
Specification for fabric woven from glass for printed circuit boards

2018-01-18

现行

IPC SG-141

Specification for Finished Fabric Woven from "S" Glass for Printed Boards
印制板用“S”玻璃织成的成品织物规范

1992-02-01

现行

IEC 61249-6-3-2023

Materials for printed boards and other interconnecting structures – Part 6-3: Sectional specification set for reinforcement materials - Specification for finished fabric woven from “E” glass for printed boards
印制板和其他互连结构用材料.第6-3部分:增强材料分规范集.印制板用“E”玻璃编织成品织物规范

2023-06-14

现行

SJ/T 11282-2003

印刷板用“E”玻璃纤维纸规范
Specification for "E" glass paper for printed boards

2003-06-04

现行

IPC A-142

Specification for Finished Fabric Woven from Aramid for Printed Boards
印制板用芳纶织成的成品织物规范

1990-06-01

现行

JIS C 6493-1999

Base materials for printed circuits -- Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed board
印制电路用基材多层印制板制造用规定可燃性的薄型聚酰亚胺编织玻璃纤维覆铜层压板

1999-01-01

现行

GB/T 12630-1990

一般用途的薄覆铜箔环氧玻璃布层压板 （制造多层印制板用）
Thin epoxide woven glass fabric copper-clad laminated sheet， general purpose grade， for use in the fabrication of multilayer printed boards

1990-12-28

现行

SJ 20224-1992

印制线路板用阻燃型覆铜箔环氧玻璃布层压板详细规范
Detail specification for epoxide woven glass fabric copper-clad laminated sheets of flammability resistance for printed wiring boards

1992-11-19

现行

GB/T 16315-2017

印制电路用覆铜箔聚酰亚胺玻纤布层压板
Polymide woven glass fabric copper clad laminated sheets for printed circuits

2017-07-31

现行

GB/T 4725-2022

印制电路用覆铜箔环氧玻纤布层压板
Epoxide woven glass fabric copper-clad laminated sheets for printed circuits

2022-03-09

现行

BS EN 60249-2-17-1993

Specifications-Specification No. 17. Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
规格

2001-06-15

现行

BS EN 60249-2-11-1994

Specifications-Specification for thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, for use in the fabrication of multilayer printed boards
规格

2001-06-15

现行

JIS C 6494-1999

Base materials for printed circuits -- Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
印制电路用基材多层印制板制造用规定可燃性的双马来酰亚胺/三嗪改性环氧玻璃纤维织物覆铜薄层压板

1999-01-01

现行

IPC QF-143

Specification for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards
印制板用石英（纯熔融石英）织成的成品织物规范

1992-02-01

现行

KS C IEC 60249-2-11(2017 Confirm)

인쇄 회로 기판 재료－제2부：규격－ 제11장：다층 인쇄 회로 기판 제조용 일반 등급의 박막 에폭시 유리 섬유 직물 동 입힘 적층판
印制电路用基材第2部分:第11号规范:多层印制板制造用通用级薄环氧玻璃纤维布覆铜层压板

2002-08-31

现行

KS C IEC 60249-2-11(2022 Confirm)

인쇄 회로 기판 재료－제2부：규격－ 제11장：다층 인쇄 회로 기판 제조용 일반 등급의 박막 에폭시 유리 섬유 직물 동 입힘 적층판
印刷电路用基材第2部分:第11号规范:多层印制板制造用通用级薄环氧玻璃织物覆铜层压板

2002-08-31