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现行 SAE AMS3695/3
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Adhesive Film, Epoxy-Base, High Durability For 175 °C (350 °F) Service 粘合剂膜 环氧树脂基 高耐用性 适用于175摄氏度(350华氏度)的环境
发布日期: 2022-01-20
本规范涵盖了一种由改性环氧树脂制成的即用薄膜,以卷或片材形式提供,由垫子或机织单丝支撑或无支撑的粘合剂。主要用于连接温度高达175摄氏度(350华氏度)的金属对金属或铝蜂窝夹层组件。粘合剂厚度0.005英寸。(0.13 mm)不适用于蜂窝-金属粘合,粘合剂厚度为0.015 in。(0.38 mm)不适用于金属对金属的粘合。
This specification covers an adhesive compounded from modified epoxy resins in ready-to-use film supplied in rolls or sheets, either supported by mat or by woven monofilaments or unsupported. Primarily for bonding metal-to-metal or aluminum honeycomb sandwich assemblies for service up to 175 degrees C (350 degrees F). Adhesive thickness 0.005 in. (0.13 mm) is not intended for honeycomb- to-metal bonds and adhesive thickness 0.015 in. (0.38 mm) is not intended for metal-to-metal bonds.
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