IEC 61837-2:20 8+A1:2020涉及标准轮廓和端子引线连接，因为它们适用于用于陶瓷外壳中频率控制和选择的表面贴装器件（SMD），并基于IEC 61240:2016。与上一版相比，此版本包括以下重大技术变更: a.修订附图以匹配IEC 61240:2016的附图符号； b.增加7个附件如下:DCC-6/5032A、DCC-6/3225A、DCC-4/3215C、DCC-6/2016A、DCC-2/2012C、DCC-2/1610C、DCC-4/1210C。 因此，第三版总共包含45种外壳类型，列于表1中。 该合并版本由第三版（2018年）及其修正案1（2020年）组成。因此，除本出版物外，无需下令修订。

IEC 61837-2:2018+A1:2020 deals with standard outlines and terminal lead connections as they apply to surface-mounted devices (SMD) for frequency control and selection in ceramic enclosures, and is based on IEC 61240:2016. This edition includes the following significant technical changes with respect to the previous edition:
a. revision of the figures to match the notation of the drawings of IEC 61240:2016;
b. addition of 7 enclosures as follows: DCC-6/5032A, DCC-6/3225A, DCC-4/3215C, DCC-6/2016A, DCC-2/2012C, DCC-2/1610C, DCC-4/1210C.
As a result, this third edition contains a total of 45 enclosure types, which are listed in Table 1.
This consolidated version consists of the third edition (2018) and its amendment 1 (2020). Therefore, no need to order amendment in addition to this publication.