建立了液体和干膜阻焊材料的评估要求，以及在标准印制板系统上使用可接受性的确定要求。IPC-SM-840提供了两类需求T和H，以反映基于行业/最终用途需求的功能性能需求和测试严重性。覆盖范围包括附着力、材料鉴定、耐溶剂性和电气要求。E版包含了用作蚀刻导体和其他导电特性上的柔性电介质保护层的柔性覆盖材料的要求。

Establishes the requirements for the evaluation of liquid and dry film solder mask material and for the determination of the acceptability of use on a standard printed board system. IPC-SM-840 provides two classes of requirements, T and H, to reflect functional performance requirements and testing severity based on industry/end use requirements. Coverage is given to adhesion, material qualification, resistances to solvents, and electrical requirements. Revision E incorporates requirements for flexible cover materials used as a flexible dielectric protective layer over etched conductors and other conductive features.