Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA) (IEC 60191-6-17:2011); German version EN 60191-6-17:2011
半导体器件的机械标准化第6-17部分:表面安装半导体器件封装外形图绘制的一般规则堆叠封装的设计指南细间距球栅阵列和细间距地栅阵列（P-PFBGA和P-PFLGA）（IEC 60191-6-1）

2011-09-01

Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)
半导体器件的机械标准化 - 第6-17部分:表面贴装半导体器件封装外形图准备的一般规则 - 堆叠封装的设计指南 - 细间距球栅阵列和细间距栅格阵列（P-Pfbga And P-Pflga）

2011-01-27

Complete, filled transport packages; general rules for the compilation of performance test schedules; part 1: general principles (ISO 4180-1:1980); german version EN 24180-1:1992
完整、完整的运输包装；编制性能测试计划的一般规则；第1部分:一般原则（ISO 4180-1:1980）；德文版EN 24180-1:1992

1993-02-01

Complete, filled transport packages; general rules for the compilation of performance test schedules; part 2: quantitative data (ISO 4180-2:1980); german version EN 24180-2:1992
完整、完整的运输包装；编制性能测试计划的一般规则；第2部分:定量数据（ISO 4180-2-1980）；德文版EN 24180-2:1992

1993-02-01