本文件规定了嵌入式辐射供暖和制冷系统的安装要求。它规定了供暖和制冷地板、天花板和墙壁结构的设计和施工的一般和统一要求，以确保供暖/制冷系统适用于特定应用。本文件规定的要求仅适用于加热/冷却系统的部件以及作为加热/冷却表面的一部分并因加热/冷却系统而安装的元件。 本文件适用于住宅、商业和工业建筑中的水基嵌入式表面加热和冷却系统。这些方法适用于集成到墙壁、地板或天花板结构中的系统，无任何开口- 空气间隙，但不适用于带有未集成到建筑结构中的开放空气间隙的面板系统。

This document establishes requirements for the installation of embedded radiant heating and cooling systems. It specifies general and uniform requirements for the design and construction of heating and cooling floors, ceiling and wall structures to ensure that the heating/cooling systems are suited to the particular application. The requirements specified by this document are applicable only to the components of the heating/cooling systems and the elements which are part of the heating/cooling surface and which are installed due to the heating/cooling systems. This document is applicable to water-based embedded surface heating and cooling systems in residential, commercial and industrial buildings. The methods apply to systems integrated into the wall, floor or ceiling construction without any open-air gaps, but are not applicable to panel systems with open-air gaps which are not integrated into the building structure.