现行

IPC 9204

Guideline on Flexibility and Stretchability Testing for Printed Electronics
印刷电子产品的柔韧性和延展性测试指南

2017-02-01

现行

BS IEC 62899-505-2020

Printed electronics-Quality assessment. Flexible gas sensor. Mechanical and thermal testing
印刷电子产品

2020-06-24

现行

IEC 62899-505-2020

Printed electronics - Part 505: Quality assessment - Flexible gas sensor - Mechanical and thermal testing
印刷电子.第505部分:质量评定.柔性气体传感器:机械和热试验

2020-06-16

现行

BS IEC 62899-501-1-2019

Printed electronics-Quality assessment. Failure modes and mechanical testing. Flexible or bendable primary or secondary cells
印刷电子产品

2019-01-23

现行

MIL MIL-STD-2118

FLEXIBLE & RIGID FLEX PRINTED WIRING FOR ELECTRONIC EQUIPMENT DESIGN REQUIREMENTS FOR(S/S BY IPC-2223 AND IPC-2221)
电子设备用柔性和刚挠印制线路的设计要求（IPC-2223和IPC-2221的S/S）

1984-05-04

现行

MIL MIL-STD-2118 Notice 2-Cancellation

FLEXIBLE & RIGID FLEX PRINTED WIRING FOR ELECTRONIC EQUIPMENT DESIGN REQUIREMENTS FOR(S/S BY IPC-2223 AND IPC-2221)
灵活

1999-08-27

现行

IEC 62899-501-1-2019

Printed electronics - Part 501-1: Quality assessment - Failure modes and mechanical testing - Flexible and/or bendable primary or secondary cells
印刷电子器件.第501-1部分:质量评定.失效模式和机械试验.柔性和/或弯曲初级或次级电池

2019-01-16

现行

BS EN 61182-7-1996

Printed boards. Electronic data description and transfer-Bare board electric test information in digital form
印制板 电子数据描述和传输 数字形式的裸板电气测试信息

1996-08-15

现行

CAN/CSA C22.2 NO.231 SERIES-M89(R01)

CSA Safety Requirements for Electrical and Electronic Measuring and Test Equipment
CSA电气和电子测量和测试设备的安全要求

2000-10-26

现行

JB/T 13034-2017

器具电子开关电气性能要求及试验方法
Technical requirements and testing methods of electrical performance in electronic switches for appliances

2017-01-09

现行

GOST 16962-1971

Изделия электронной техники и электротехники. Механические и климатические воздействия. Требования и методы испытаний
电子电气设备 机械和气候影响 要求和测试方法

现行

BS IEC 62899-502-2-2019

Printed electronics-Quality assessment. Organic light emitting diode (OLED) elements. Combined mechanical and environmental stress test methods for flexible OLED elements
印刷电子产品

2019-08-02

现行

BS EN IEC 61191-1-2018

Printed board assemblies-Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
印制板组件

2018-11-13

现行

NB/T 10725-2021

煤矿用电工电子产品电磁兼容性要求及试验方法
Requirements and test methods of electromagnetic compatibility of electric and electronic products in the coal mine

2021-11-16

现行

KS C IEC 62899-502-1

인쇄전자 — 제502-1부: 품질 평가 —유기 발광 다이오드(OLED) 소자 —플렉시블 기판 상에 형성된 OLED 소자의 기계적 스트레스 시험
印刷电子 - 第502-1部分:质量评估 - 有机发光二极管（Oled）元件 - 柔性基板上形成的Oled元件的机械应力测试

2020-12-16

现行

IEC 62899-502-1-2017

Printed electronics - Part 502-1: Quality assessment - Organic light emitting diode (OLED) elements - Mechanical stress testing of OLED elements formed on flexible substrates
印刷电子 - 第502-1部分:质量评估 - 有机发光二极管（Oled）元件 - 柔性基板上形成的Oled元件的机械应力测试

2017-03-07

现行

BS IEC 62899-502-1-2017

Printed electronics-- Part 502-1: Quality assessment - Organic light emitting diode (OLED) elements - Mechanical stress testing of OLED elements formed on flexible substrates
印刷电子产品

2017-03-21

现行

KS C IEC 61191-1(2016 Confirm)

인쇄기판 조립품－제1부：품목규격：표면실장 및 관련 조립기술을 이용하여 납땜된 전기전자 조립품에 대한 요구사항
印制板组件第1部分:总规范采用表面安装和相关组装技术的焊接电气和电子组件的要求

2006-12-18

现行

KS C IEC 61191-1

인쇄회로기판 조립품 —제1부: 일반규격 — 표면실장 및 관련 실장기술을 이용하여 솔더링한 전기전자 조립품에 대한 요구사항
印制板组件.第1部分:总规范.使用表面安装和相关组装技术的焊接电气和电子组件的要求

2021-10-19

现行

IEC 61191-1-2018 RLV

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
印制板组件.第1部分:总规范.使用表面安装和相关组装技术的焊接电气和电子组件的要求

2018-09-14