现行

DIN 41881-2

Semiconductor devices; metal cases with ceramic insulation, requirements and tests
半导体器件；陶瓷绝缘金属外壳.要求和试验

1978-06-01

现行

IEC 60747-15-2024 RLV

Semiconductor devices - Part 15: Discrete devices - Isolated power semiconductor devices
半导体器件第15部分:分立器件隔离功率半导体器件

2024-10-22

现行

IEC 60747-15-2024

Semiconductor devices - Part 15: Discrete devices - Isolated power semiconductor devices
半导体器件第15部分:分立器件隔离功率半导体器件

2024-10-22

现行

BS 07/30162213 DC

BS EN 60747-15. Semiconductor devices. Discrete devices Part 15. Isolated power semiconductor devices
英国标准EN 60747-15 半导体器件 分立器件第15部分 隔离功率半导体器件

2007-02-07

现行

IEC 63244-1-2021

Semiconductor devices - Semiconductor devices for wireless power transfer and charging - Part 1: General requirements and specifications
半导体器件.无线功率传输和充电用半导体器件.第1部分:一般要求和规范

2021-09-14

现行

GB/T 8446.1-2022

电力半导体器件用散热器 第1部分：散热体
Heat sinks for power semiconductor devices—Part 1: Radiators

2022-03-09

现行

DIN IEC 60747-15-DRAFT

Draft Document - Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices (IEC 47E/322/CD:2007)
文件草案.半导体器件.分立器件.第15部分:隔离功率半导体器件（IEC 47E/322/CD:2007）

2007-06-01

现行

IEC 62830-2-2017

Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 2: Thermo power based thermoelectric energy harvesting
半导体器件 - 用于能量收集和生成的半导体器件 - 第2部分:基于热能的热电收获

2017-01-20

现行

IEC 62435-9-2021

Electronic components - Long-term storage of electronic semiconductor devices - Part 9: Special cases
电子元件.电子半导体器件的长期贮存.第9部分:特殊情况

2021-08-25

现行

GB/T 8446.3-2022

电力半导体器件用散热器 第3部分：绝缘件和紧固件
Heat sinks for power semiconductor devices—Part 3: Insulators and fasteners

2022-03-09

现行

IEC 62830-5-2021

Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 5: Test method for measuring generated power from flexible thermoelectric devices
半导体器件.能量收集和产生用半导体器件.第5部分:测量柔性热电器件产生功率的试验方法

2021-01-21

现行

KS C IEC 60749-34

반도체 소자－기계 및 기후적 환경 시험 방법－제34부：전력 사이클링
半导体器件机械和气候试验方法第34部分:功率循环

2017-05-30

现行

IEC 60749-34-2010

Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
半导体器件 - 机械和气候测试方法 - 第34部分:电力循环

2010-10-28

现行

KS C IEC 60749-34(2022 Confirm)

반도체 소자－기계 및 기후적 환경 시험 방법－제34부：전력 사이클링
半导体器件机械和气候试验方法第34部分:功率循环

2017-05-30

现行

UNE-EN 60749-34-2005

Semiconductor devices - Mechanical and climatic test methods -- Part 34: Power cycling
半导体器件机械和气候试验方法第34部分:功率循环

2005-03-16

现行

GB/T 4937.34-2024

半导体器件 机械和气候试验方法 第34部分：功率循环
Semiconductor devices—Mechanical and climatic test methods—Part 34:Power cycling

2024-03-15

现行

IEC 62969-1-2017

Semiconductor devices - Semiconductor interface for automotive vehicles - Part 1: General requirements of power interface for automotive vehicle sensors
半导体器件汽车半导体接口第1部分:汽车传感器电源接口的一般要求

2017-12-13

现行

GB/T 7576-1998

半导体器件 分立器件 第7部分:双极型晶体管 第四篇 高频放大管壳额定双极型晶体管空白详细规范
Semiconductor devices--Discrete devices--Part 7:Bipolar transistors--Section Four:Blank detail specification for case-rated bipolartransistors for high-frequency amplification

1998-11-17

现行

IEC 62830-8-2021

Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 8: Test and evaluation methods of flexible and stretchable supercapacitors for use in low power electronics
半导体器件.能量收集和发电用半导体器件.第8部分:低功率电子设备用柔性和可拉伸超级电容器的试验和评估方法

2021-10-22

现行

KS C IEC 60747-7-2(2016 Confirm)

반도체 소자－개별 소자－제7부：바이폴러 트랜지스터－제2절：저주파 증폭용 케이스 정격 바이폴러 트랜지스터의 개별 규격 지침
半导体器件分立器件第7部分:双极晶体管第2节:低频放大用外壳额定双极晶体管空白详细规范

2006-12-11