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现行 IEC 62047-12:2011
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Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures 半导体器件 - 微机电器件 - 第12部分:使用谐振器振荡的薄膜材料的弯曲疲劳测试方法
发布日期: 2011-09-13
IEC 62047-12:20 11规定了一种使用MEMS(微机电系统)和微机械的微尺度机械结构的共振进行弯曲疲劳测试的方法。本标准适用于平面方向尺寸范围为10 μ m至1000 μ m、厚度范围为1 μ m至100 μ m的振动结构,以及长度小于1mm、宽度小于1mm、厚度在0.1 μ m至10 μ m之间的测试材料。用于MEMS、微机械等的主要结构材料。具有特殊的特征,例如几微米的典型尺寸、通过沉积的材料制造以及通过非机械加工的手段(包括光刻)制造测试件。MEMS结构通常具有比宏观结构更高的基本谐振频率和更高的强度。为了评估和保证MEMS结构的寿命,需要建立超高循环(高达1012)载荷的疲劳测试方法。该测试方法的目的是通过使用共振振动施加高载荷和高循环频率弯曲应力,在短时间内评估微尺度材料的机械疲劳性能。
IEC 62047-12:2011 specifies a method for bending fatigue testing using resonant vibration of microscale mechanical structures of MEMS (micro-electromechanical systems) and micromachines. This standard applies to vibrating structures ranging in size from 10 μm to 1 000 μm in the plane direction and from 1 μm to 100 μm in thickness, and test materials measuring under 1 mm in length, under 1 mm in width, and between 0,1 μm and 10 μm in thickness. The main structural materials for MEMS, micromachine, etc. have special features, such as typical dimensions of a few microns, material fabrication by deposition, and test piece fabrication by means of non-mechanical machining, including photolithography. The MEMS structures often have higher fundamental resonant frequency and higher strength than macro structures. To evaluate and assure the lifetime of MEMS structures, a fatigue testing method with ultra high cycles (up to 1012) loadings needs to be established. The object of the test method is to evaluate the mechanical fatigue properties of microscale materials in a short time by applying high load and high cyclic frequency bending stress using resonant vibration.
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归口单位: TC 47/SC 47F
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