首页 馆藏资源 舆情信息 标准服务 科研活动 关于我们
现行 IEC TR 61967-1-1:2015
到馆阅读
收藏跟踪
购买正版
Integrated circuits - Measurement of electromagnetic emissions - Part 1-1: General conditions and definitions - Near-field scan data exchange format 集成电路.电磁发射的测量.第1-1部分:一般条件和定义.近场扫描数据交换格式
发布日期: 2015-08-28
IEC TR 61967-1-1:20 15(E)为交换近场扫描测量产生的数据提供了指南。所描述的交换格式也可以用于由模拟或计算软件生成的近场扫描数据。应该注意的是,虽然它已经被开发用于近场扫描,但它的使用不限于该应用。交换格式可以应用于频域和时域中的发射和抗扰度近场扫描数据。本技术报告的范围既不包括用于测量或模拟的方法,也不包括用于生成交换文件或用于处理或查看其中包含的数据的软件和算法。与上一版相比,此版本包含以下重大变更: -添加:3D对象;二进制数据文件;分段线性时域和频域数据;允许测量和DUT参考平面旋转和偏移的矢量;换能器增益和探头因子可以是复杂的;新增关键字:Object3d、Mapobj、Maxhold、Datafileformat、Vx、Vy、Vz、Target、Software、Data_source。 -更新:探针因子和相应的关键字。 -修改:关键词:平均。
IEC TR 61967-1-1:2015(E) provides guidance for exchanging data generated by near-field scan measurements. The described exchange format could also be used for near-field scan data generated by simulation or computation software. It should be noted that, although it has been developed for near-field scan, its use is not restricted to this application. The exchange format can be applied to emission and immunity near-field scan data in the frequency and time domains. The scope of this technical report includes neither the methods used for the measurements or simulations, nor the software and algorithms used for generating the exchange file or for processing or viewing the data contained therein. This edition includes the following significant changes with respect to the previous edition:
- Addition of: 3D objects; Binary data files; Piece-wise linear time domain and frequency domain data; Vectors permitting rotation and offset of measurement and DUT reference planes; Transducer gain and probe factor can be complex; New keywords: Object3d, Mapobj, Maxhold, Datafileformat, Vx, Vy, Vz, Target, Software, Data_source.
- Updating of: Probe factor and corresponding keywords.
- Modification of: Keywords: Average.
分类信息
关联关系
研制信息
归口单位: TC 47/SC 47A
相似标准/计划/法规
现行
IEC TS 61967-3-2014
Integrated circuits - Measurement of electromagnetic emissions - Part 3: Measurement of radiated emissions - Surface scan method
集成电路.电磁发射的测量.第3部分:辐射发射的测量.表面扫描法
2014-08-25
现行
IEC 61967-8-2023 RLV
Integrated circuits - Measurement of electromagnetic emissions - Part 8: Measurement of radiated emissions - IC stripline method
集成电路.电磁发射的测量.第8部分:辐射发射的测量.IC带状线法
2023-05-03
现行
IEC 61967-8-2023
Integrated circuits - Measurement of electromagnetic emissions - Part 8: Measurement of radiated emissions - IC stripline method
集成电路.电磁发射的测量.第8部分:辐射发射的测量.IC带状线法
2023-05-03
现行
BS EN IEC 61967-1-2019
Integrated circuits. Measurement of electromagnetic emissions-General conditions and definitions
集成电路 电磁辐射的测量 一般条件和定义
2019-02-21
现行
IEC 61967-1-2018 RLV
Integrated circuits - Measurement of electromagnetic emissions - Part 1: General conditions and definitions
集成电路.电磁辐射的测量.第1部分:一般条件和定义
2018-12-12
现行
IEC 61967-1-2018
Integrated circuits - Measurement of electromagnetic emissions - Part 1: General conditions and definitions
集成电路电磁辐射测量第1部分:一般条件和定义
2018-12-12
现行
SJ 21147.3-2016
军用集成电路电磁发射测量方法 第3部分:辐射发射测量-表面扫描法
Measurement of electromagnetic emissions for military integrated circuits - Part 3:Measurement of radiated emissions - Surface scan method
2016-01-19
现行
SJ 21147.1-2016
军用集成电路电磁发射测量方法 第1部分:通用条件和定义
Measurement of electromagnetic emissions for military integrated circuits - Part 1:General conditions and definitions
2016-01-19
现行
SJ 21147.5-2016
军用集成电路电磁发射测量方法 第5部分:传导发射测量-工作台法拉第笼法
Measurement of electromagnetic emissions for military integrated circuits - Part 5:Measurement of conducted emissions - Workbench Faraday Cage method
2016-01-19
现行
SJ 21147.4-2016
军用集成电路电磁发射测量方法 第4部分:传导发射测量 - 1Ω/150Ω直接耦合法
Measurement of electromagnetic emissions for military integrated circuits - Part 4:Measurement of conducted emissions - 1Ω/150Ω direct coupling method
2016-01-19
现行
SJ 21147.2-2016
军用集成电路电磁发射测量方法 第2部分:辐射发射测量-TEM小室和宽带TEM小室法
Measurement of electromagnetic emissions for military integrated circuits - Part 2:Measurement of radiated emissions - TEM cell and wideband TEM cell method
2016-01-19
现行
IEC 61967-6-2002
Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method
集成电路 - 电磁辐射测量 150赫兹至1 Ghz - 第6部分:传导发射测量 - 磁探针法
2002-06-25
现行
IEC 61967-4-2021
Integrated circuits - Measurement of electromagnetic emissions - Part 4: Measurement of conducted emissions - 1 ohm/150 ohm direct coupling method
集成电路电磁发射测量第4部分:1欧姆/150欧姆直接耦合法测量传导发射
2021-03-16
现行
IEC 61967-6-2002+AMD1-2008 CSV
Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method
集成电路.150kHz至1GHz电磁发射的测量.第6部分:传导发射的测量.磁探针法
2008-06-24
现行
IEC 61967-4-2021 RLV
Integrated circuits - Measurement of electromagnetic emissions - Part 4: Measurement of conducted emissions - 1 ohm/150 ohm direct coupling method
集成电路电磁发射的测量第4部分:传导发射的测量1欧姆/150欧姆直接耦合法
2021-03-16
现行
BS EN IEC 61967-4-2021
Integrated circuits. Measurement of electromagnetic emissions-Measurement of conducted emissions. 1 Ω/150 Ω direct coupling method
集成电路 电磁辐射测量
2021-05-06
现行
DIN IEC/TS 61967-3
Integrated circuits - Measurement of electromagnetic emissions - Part 3: Measurement of radiated emissions - Surface scan method (IEC/TS 61967-3:2014)
集成电路.电磁发射的测量.第3部分:辐射发射的测量.表面扫描法(IEC/TS 61967-3-2014)
2015-08-01
现行
BS EN 61967-5-2003
Integrated circuits. Measurement of electromagnetic emissions, 150 kHz to 1 GHz-Measurement of conducted emissions. Workbench Faraday Cage method
集成电路 电磁辐射测量 150 kHz至1 GHz
2003-06-17
现行
IEC 61967-6-2002/AMD1-2008
Amendment 1 - Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method
修改件1.集成电路.150 kHz至1 GHz电磁发射的测量.第6部分:传导发射的测量.磁探针法
2008-03-12
现行
IEC 61967-2-2005
Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 2: Measurement of radiated emissions - TEM cell and wideband TEM cell method
集成电路 - 电磁辐射测量 150 Khz至1 Ghz - 第2部分:辐射辐射测量 - 温度计和宽带温度计方法
2005-09-29