1.1 本试验方法定义了一种电阻探测试验，用于检测印刷线路板（PWB）触点或手指上是否存在对电气性能产生不利影响的异物。本试验方法专门针对涂有金的手指。将本试验方法应用于其他类型的电触点或涂有其他材料的手指可能是可行且可取的，但可能需要对夹具、程序或故障标准进行一些更改。 1.2 实践 B667 描述了另一种接触电阻探针方法，该方法更广泛地应用于各种材料和形状的电触点。实践 B667 应该用于更基础的研究。本试验方法为印刷线路板指状物提供了一种快速检查方法。 1.3 以国际单位制表示的数值应视为标准值。本标准不包括其他计量单位。 1.4 本标准并非旨在解决与其使用相关的所有安全问题（如有）。本标准的用户有责任熟悉所有危险，包括制造商提供的本产品/材料的适当材料安全数据表（MSDS）中确定的危险，建立适当的安全、健康和环境实践，并在使用前确定监管限制的适用性。 1.5 本国际标准是根据世界贸易组织技术性贸易壁垒（TBT）委员会发布的《关于制定国际标准、指南和建议的原则的决定》中确立的国际公认标准化原则制定的。 ====意义和用途====== 5.1 本试验方法提供了一种检测印刷线路板指状物上影响此类指状物电气性能的污染的方法。 这种污染可能在印制电路板制造、电路组装或使用寿命期间产生，可能包括阻焊膜、焊剂、硬化润滑剂、灰尘或其他材料。本试验方法提供了一种无损检测方法，用于在产品寿命的任何时间点检查这些手指，包括原始制造后、将电路组件组装到PWB后以及在使用时间后（如返回维修时）。由于该测试方法使用两个探针串联手指触点，因此当手指插入edgecard连接器时，它提供了一种敏感的污染物测试，这些污染物可能会增加电阻，edgecard连接器通常仅通过一个触点到手指的接口与手指接触。 5.2 实践 B667 描述了一种更通用的程序，用于测量几乎任何几何形状的任何固体材料的接触电阻。实践中的方法 B667 应用于电接触材料的一般研究和基础研究。

1.1 This test method defines a resistance probing test for detecting the presence of foreign matter on Printed Wiring Board (PWB) contacts or fingers that adversely affects electrical performance. This test method is defined specifically for such fingers coated with gold. Application of this test method to other types of electrical contacts or to fingers coated with other materials may be possible and desirable but may require some changes in fixturing, procedures, or failure criteria. 1.2 Practice B667 describes another contact resistance probe method that has more general application to electrical contacts of various materials and shapes. Practice B667 should be used for more fundamental studies. This test method provides a fast inspection method for printed wiring board fingers. 1.3 The values stated in SI units are to be regarded as standard. No other units of measurement are included in this standard. 1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to become familiar will all hazards including those identified in the appropriate Material Safety Data Sheet (MSDS) for this product/material as provided by the manufacturer, to establish appropriate safety, health, and environmental practices, and determine the applicability of regulatory limitations prior to use. 1.5 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee. ====== Significance And Use ====== 5.1 This test method provides a way to detect contamination on printed wiring board fingers that affects the electrical performance of such fingers. Such contamination may arise during PWB manufacture, circuit assembly, or service life and may include solder mask, solder flux, hardened lubricants, dust, or other materials. This test method provides a nondestructive method of inspecting such fingers at any point in the life of the product including after original manufacture, after assembly of circuit components to the PWB, and after time in service such as when returned for repair. Because this test method uses two probes to finger contacts in series, it provides a sensitive test for contaminants that may increase electrical resistance when the fingers are plugged into an edgecard connector that typically makes contact to the finger through only one contact to finger interface. 5.2 Practice B667 describes a more general procedure for measuring contact resistance of any solid material in practically any geometrical form. The method in Practice B667 should be used for general studies and fundamental studies of electrical contact materials.