为了降低结构陶瓷研磨成本，橡树岭国家实验室资助了一项可行性研究，以开发一种单步粗加工-精加工工艺，适用于以高材料去除率生产高质量氮化硅陶瓷零件，且成本大大低于传统的多段研磨工艺。本文提供了高速低损伤（HSLD）陶瓷磨削工艺的技术概述，该工艺使用高砂轮扩展，以在高材料去除率下实现低损伤磨削所需的小切粒深度。

IN AN EFFORT TO REDUCE STRUCTURAL CERAMIC GRINDING COSTS, A FEASIBILITY INVESTIGATION WAS FUNDED BY OAK RIDGE NATIONAL LABORATORIES TO DEVELOP A SINGLE STEP, ROUGHING FINISHING PROCESS SUITABLE FOR PRODUCING HIGH QUALITY SILICON NITRIDE CERAMIC PARTS AT HIGH MATERIAL REMOVAL RATES AND AT SUBSTANTIALLY LOWER COST THAN TRADITIONAL, MULTI-STAGE GRINDING PROCESSES. THE PAPER PROVIDES A TECHNICAL OVERVIEW OF THE HIGH SPEED LOW DAMAGE (HSLD) CERAMIC GRINDING PROCESS USING ELEVATED WHEEL SPREADS TO ACHIEVE THE SMALL GRAIN DEPTHS OF CUT NECESSARY FOR LOW DAMAGE GRINDING WHILE OPERATING AT HIGH MATERIAL REMOVAL RATES.