Printed electronics - Part 304-1: Equipment - Sintering - Temperature measurement method for photonic sintering system
印刷电子器件.第304-1部分:设备.烧结.光子烧结系统的温度测量方法
IEC TR 62899-304-1:2023, which is a technical report, provides technical information relating to surface temperature measurement of the substrate containing the printed patterns and films applicable to the photonic sintering system used in the printed electronics industry.