现行

BS 4584-103.2-1990

Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits-Specification for copper foil for use in the manufacture of copper-clad base materials
印制线路板用金属覆层基材 与印刷电路有关的特殊材料 覆铜基材制造用铜箔规范

1990-02-28

现行

GB/T 36476-2018

印制电路用金属基覆铜箔层压板通用规范
General specification for metal base copper-clad laminates for printed circuits

2018-06-07

现行

BS 4584-13-1977

Specification for metal-clad base materials for printed circuits-Silicone woven glass fabric copper-clad laminated sheet Si-GC-Cu-13
印制电路用金属覆层基材规范 硅机织玻璃纤维覆铜层压板Si-GC-Cu-13

1977-11-30

现行

BS EN 60249-2-13-1994

Base material for printed circuits. Specifications-Flexible copper-clad polyimide film, general purpose grade
印刷电路的基材 规格 通用级挠性覆铜聚酰亚胺薄膜

1990-02-28

现行

BS EN 60249-2-3-1994

Specifications-Metal-clad base materials for printed wiring boards. Copper-clad base material. Specification for epoxide cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test)
规格

2001-04-15

现行

BS 4584-5-1972

Specification for metal-clad base materials for printed circuits-Phenolic cellulose paper copper-clad laminated sheet of medium electrical quality: PF-CP-Cu-5
印制电路用金属覆层基材规范 中等电气质量酚醛纤维素纸覆铜层压板:PF-CP-Cu-5

1972-07-28

现行

BS 4584-103.1-1990

Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits-Specification for prepreg for use as a bonding sheet material in the fabrication of multilayer printed board
印制线路板用金属覆层基材 与印刷电路有关的特殊材料 多层印制板制造中用作粘合片材料的预浸料规范

1990-02-28

现行

UNE-EN 60249-2-8-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 8: FLEXIBLE COPPER-CLAD POLYESTER (PETP) FILM.
印刷电路的基材 第2部分:规范 规格8:柔性覆铜聚酯（PETP）薄膜

1996-07-24

现行

UNE-EN 60249-2-8/A1-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 8: FLEXIBLE COPPER-CLAD POLYESTER (PETP) FILM.
印刷电路的基材 第2部分:规范 规格8:柔性覆铜聚酯（PETP）薄膜

1996-10-23

现行

BS 4584-6-1972

Specification for metal-clad base materials for printed circuits-Phenolic cellulose paper copper-clad laminated sheet of medium electrical quality, flame retardant grade: PF-CP-Cu-6
印制电路用金属覆层基材规范 阻燃级中等电气质量酚醛纤维素纸覆铜层压板:PF-CP-Cu-6

1972-07-28

现行

BS 4584-103.3-1992

Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits-Specification for permanent polymer coating materials (solder resist) for use in the fabrication of printed boards
印制线路板用金属覆层基材 与印刷电路有关的特殊材料 印制板制造用永久性聚合物涂层材料（阻焊剂）规范

1992-03-31

现行

UNE-EN 60249-2-15/A1-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 15: FLEXIBLE COPPER-CLAD POLYIMIDE FILM, OF DEFINED FLAMMABILITY.
印刷电路的基材 第2部分:规范 规范15:规定易燃性的挠性覆铜聚酰亚胺薄膜

1996-10-14

现行

UNE-EN 60249-2-15-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 15: FLEXIBLE COPPER-CLAD POLYIMIDE FILM, OF DEFINED FLAMMABILITY.
印刷电路的基材 第2部分:规范 规范15:规定易燃性的挠性覆铜聚酰亚胺薄膜

1996-07-24

现行

JIS C 6490-1998

Base materials for printed circuits -- Polyimide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)
印制电路用基材规定可燃性的聚酰亚胺玻璃纤维织物覆铜层压板（垂直燃烧试验）

1998-01-01

现行

JIS C 6493-1999

Base materials for printed circuits -- Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed board
印制电路用基材多层印制板制造用规定可燃性的薄型聚酰亚胺编织玻璃纤维覆铜层压板

1999-01-01

现行

UNE-EN 60249-2-13/A1-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 13: FLEXIBLE COPPER-CLAD POLYIMIDE FILM, GENERAL PURPOSE GRADE.
印刷电路的基材 第2部分:规范 规范13:通用级挠性覆铜聚酰亚胺薄膜

1996-10-16

现行

UNE-EN 60249-2-13-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 13: FLEXIBLE COPPER-CLAD POLYIMIDE FILM, GENERAL PURPOSE GRADE.
印刷电路的基材 第2部分:规范 规范13:通用级挠性覆铜聚酰亚胺薄膜

1996-07-24

现行

KS C IEC 60249-2-1(2017 Confirm)

인쇄 회로 기판 재료－제2부：규격－제1장：고급형 페놀셀룰로오스 종이 동입힘 적층판
印制电路用基材第2部分:规范第1号规范:高电气质量酚醛纤维素纸覆铜箔层压板

2002-05-30

现行

UNE-EN 60249-2-1/A2-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICAION Nº1: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET, HIGH ELECTRICAL QUALITY.
印刷电路的基材 第2部分:规范 规格1:酚醛纤维素纸覆铜层压板 高电气质量

1996-10-14

现行

UNE-EN 60249-2-2/A3-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 2: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET, ECONOMIC QUALITY.
印刷电路的基材 第2部分:规范 规范2:酚醛纤维素纸覆铜层压板 经济质量

1996-10-14