建立可靠印刷线路组件的设计概念、指南和程序。专注于SMT或混合技术PWA，特别是解决互连结构和焊点本身。讨论基板、组件、连接材料、成本和组装过程以及测试注意事项。此外，本文件包含详细的附录，包括:焊接附件；镀通孔结构；绝缘电阻；热因素；环境压力；热膨胀系数；静电放电；溶剂；可测试性；腐蚀航空航天和高空问题。

Establishes design concepts, guidelines and procedures for reliable printed wiring assemblies. Focuses on SMT or mixed technology PWAs, specifically addressing the interconnect structure and the solder joint itself. Discusses substrates, components, attachment materials, costings and assembly processes and testing considerations. In addition, this document contains detailed appendices covering: solder attachments; plated-through via structures; insulation resistance; thermal considerations; environmental stresses; coefficient of thermal expansion; electrostatic discharge; solvents; testability; corrosion aerospace and high altitude concerns.