现行

MIL MIL-S-13949/13C Notice 1-Inactivation

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GI (WOVEN E-GLASS REINFORCEMENT, POLYIMIDE RESIN) (SUPERSEDING MIL-S-13949/13B) (NO S/S DOCUMENT)
片材、印刷线路板、预浸料、基材GI（编织电子玻璃增强材料、聚酰亚胺树脂）（取代MIL-S-13949/13B）（无S/S文件）

1997-08-01

现行

MIL MIL-S-13949/13C

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GI (WOVEN E-GLASS REINFORCEMENT, POLYIMIDE RESIN) (SUPERSEDING MIL-S-13949/13B) (NO S/S DOCUMENT)
薄板、印刷线路板、预浸料、基材GI（编织E玻璃增强、聚酰亚胺树脂）（替代MIL-S-13949/13B）（无S/S文件）

1993-08-06

现行

MIL MIL-S-13949/11B

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GE (WOVEN E-GLASS REINFORCEMENT, MAJORITY DIFUNCTIONAL EPOXY RESIN) (SUPERSEDING MIL-S-13949/11A) (NO S/S DOCUMENT)
板材、印刷线路板、预浸料、基材GE（编织E-玻璃增强、多数双功能环氧树脂）（取代MIL-S-13949/11A）（无S/S文件）

1994-06-06

现行

MIL MIL-S-13949/11B Notice 1-Inactivation

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GE (WOVEN E-GLASS REINFORCEMENT, MAJORITY DIFUNCTIONAL EPOXY RESIN) (SUPERSEDING MIL-S-13949/11A) (NO S/S DOCUMENT)
片材、印刷线路板、预浸料、基材GE（编织电子玻璃增强材料、多数双功能环氧树脂）（取代MIL-S-13949/11A）（无S/S文件）

1997-08-01

现行

MIL MIL-S-13949/26A

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GM (WOVEN E-GLASS REINFORCEMENT, TRIAZINE AND OR BISMALEIMIDE MODIFIED EPOXY RESIN) (SUPERSEDING MIL-S-13949/26) (NO S/S DOCUMENT)
薄板、印刷线路板、预浸料、基材GM（编织E-玻璃增强、三嗪和/或双马来酰亚胺改性环氧树脂）（取代MIL-S-13949/26）（无S/S文件）

1993-04-11

现行

MIL MIL-S-13949/26A Notice 1-Inactivation

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GM (WOVEN E-GLASS REINFORCEMENT, TRIAZINE AND OR BISMALEIMIDE MODIFIED EPOXY RESIN) (SUPERSEDING MIL-S-13949/26) (NO S/S DOCUMENT)
片材、印刷线路板、预浸料、基材GM（编织电子玻璃增强材料、三嗪和/或双马来酰亚胺改性环氧树脂）（取代MIL-S-13949/26）（无S/S文件）

1997-08-01

现行

MIL MIL-S-13949/30A

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GC (WOVEN E-GLASS REINFORCEMENT, MAJORITY CYANATE ESTER RESIN, FLAME RESISTANT) (SUPERSEDING MIL-S-13949/30) (NO S/S DOCUMENT)
板材、印刷线路板、预浸料、基材GC（编织E玻璃增强、多数氰酸酯树脂、阻燃）（替代MIL-S-13949/30）（无S/S文件）

1993-05-18

现行

MIL MIL-S-13949/12B

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GF (WOVEN E-GLASS REINFORCEMENT, MAJORITY DIFUNCTIONAL EPOXY RESIN, FLAME RESISTANT) (SUPERSEDING MIL-S-13949/12A) (NO S/S DOCUMENT)
板材、印刷线路板、预浸料、基材GF（编织E-玻璃增强、多数双功能环氧树脂、阻燃）（替代MIL-S-13949/12A）（无S/S文件）

1993-08-16

现行

MIL MIL-S-13949/12B Notice 1-Inactivation

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GF (WOVEN E-GLASS REINFORCEMENT, MAJORITY DIFUNCTIONAL EPOXY RESIN, FLAME RESISTANT) (SUPERSEDING MIL-S-13949/12A) (NO S/S DOCUMENT)
片材 印刷线路板 预浸料 基材GF（编织电子玻璃增强材料 多数双功能环氧树脂 阻燃）（取代MIL-S-13949/12A）（无文件）

1997-08-01

现行

MIL MIL-S-13949/10C Notice 1-Inactivation

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL GI (WOVEN E-GLASS REINFORCEMENT, POLYIMIDE RESIN, HEAT RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/10B) (NO S/S DOCUMENT)
层压印刷线路板片材 基材GI（编织电子玻璃增强材料、聚酰亚胺树脂、耐热、金属包覆或非包覆）（取代MIL-S-13949/10B）（无S/S文件）

1997-08-01

现行

MIL MIL-S-13949/10C

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL GI (WOVEN E-GLASS REINFORCEMENT, POLYIMIDE RESIN, HEAT RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/10B) (NO S/S DOCUMENT)
基材GI层压印刷线路板（编织E玻璃增强、聚酰亚胺树脂、耐热、金属包覆或非包覆）（替代MIL-S-13949/10B）（无S/S文件）

1993-08-06

现行

MIL MIL-S-13949/18A Notice 1-Inactivation

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GH (WOVEN E-GLASS REINFORCEMENT, MAJORITY POLYFUNCTIONAL EPOXY RESIN, HOT STRENGTH RETENTION, FLAME RESISTANT) (SUPERSEDING MIL-S-13949/18) (NO S/S DOCUMENT)
片材、印刷线路板、预浸料、基材GH（编织电子玻璃增强材料、多数多功能环氧树脂、热强度保持性、阻燃性）（取代MIL-S-13949/18）（无文件）

1997-08-01

现行

MIL MIL-S-13949/18A Notice 2-Cancellation

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GH (WOVEN E-GLASS REINFORCEMENT, MAJORITY POLYFUNCTIONAL EPOXY RESIN, HOT STRENGTH RETENTION, FLAME RESISTANT) (SUPERSEDING MIL-S-13949/18) (NO S/S DOCUMENT)
片材、印刷线路板、预浸料、基材GH（编织电子玻璃增强材料、多数多功能环氧树脂、热强度保持性、阻燃性）（取代MIL-S-13949/18）（无文件）

1998-11-30

现行

MIL MIL-S-13949/18A

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GH (WOVEN E-GLASS REINFORCEMENT, MAJORITY POLYFUNCTIONAL EPOXY RESIN, HOT STRENGTH RETENTION, FLAME RESISTANT) (SUPERSEDING MIL-S-13949/18) (NO S/S DOCUMENT)
板材、印刷线路板、预浸料、基材GH（编织E玻璃增强、多数多功能环氧树脂、热强度保持、阻燃）（替代MIL-S-13949/18）（无S/S文件）

1993-08-06

现行

MIL MIL-S-13949/20A

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL QI (WOVEN QUARTZ REINFORCEMENT, POLYIMIDE RESIN) (SUPERSEDING MIL-S-13949/20) (NO S/S DOCUMENT)
薄板、印刷线路板、预浸料、基材QI（编织石英增强、聚酰亚胺树脂）（替代MIL-S-13949/20）（无S/S文件）

1993-12-06

现行

MIL MIL-S-13949/20A Notice 1-Inactivation

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL QI (WOVEN QUARTZ REINFORCEMENT, POLYIMIDE RESIN) (SUPERSEDING MIL-S-13949/20) (NO S/S DOCUMENT)
片材、印刷线路板、预浸料、基材QI（编织石英增强材料、聚酰亚胺树脂）（替代MIL-S-13949/20）（无S/S文件）

1997-08-01

现行

MIL MIL-S-13949/20A Notice 2-Cancellation

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL QI (WOVEN QUARTZ REINFORCEMENT, POLYIMIDE RESIN) (SUPERSEDING MIL-S-13949/20) (NO S/S DOCUMENT)
片材、印刷线路板、预浸料、基材QI（编织石英增强材料、聚酰亚胺树脂）（替代MIL-S-13949/20）（无S/S文件）

1998-11-30

现行

MIL MIL-S-13949/16B

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL AF (WOVEN ARAMID REINFORCEMENT, EPOXY RESIN, FLAME RESISTANT) (SUPERSEDING MIL-S-13949/16A) (NO S/S DOCUMENT)
板材、印刷线路板、预浸料、基材AF（编织芳纶增强、环氧树脂、阻燃）（替代MIL-S-13949/16A）（无S/S文件）

1993-03-28

现行

MIL MIL-S-13949/16B Notice 1-Inactivation

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL AF (WOVEN ARAMID REINFORCEMENT, EPOXY RESIN, FLAME RESISTANT) (SUPERSEDING MIL-S-13949/16A) (NO S/S DOCUMENT)
片材、印刷线路板、预浸料、基材AF（芳纶编织增强材料、环氧树脂、阻燃）（取代MIL-S-13949/16A）（无文件）

1997-08-01

现行

MIL MIL-S-13949/16B Notice 2-Cancellation

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL AF (WOVEN ARAMID REINFORCEMENT, EPOXY RESIN, FLAME RESISTANT) (SUPERSEDING MIL-S-13949/16A) (NO S/S DOCUMENT)
片材、印刷线路板、预浸料、基材AF（芳纶编织增强材料、环氧树脂、阻燃）（取代MIL-S-13949/16A）（无文件）

1998-11-30