现行

MIL MIL-S-13949/11B Notice 1-Inactivation

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GE (WOVEN E-GLASS REINFORCEMENT, MAJORITY DIFUNCTIONAL EPOXY RESIN) (SUPERSEDING MIL-S-13949/11A) (NO S/S DOCUMENT)
片材、印刷线路板、预浸料、基材GE（编织电子玻璃增强材料、多数双功能环氧树脂）（取代MIL-S-13949/11A）（无S/S文件）

1997-08-01

现行

MIL MIL-S-13949/13C Notice 1-Inactivation

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GI (WOVEN E-GLASS REINFORCEMENT, POLYIMIDE RESIN) (SUPERSEDING MIL-S-13949/13B) (NO S/S DOCUMENT)
片材、印刷线路板、预浸料、基材GI（编织电子玻璃增强材料、聚酰亚胺树脂）（取代MIL-S-13949/13B）（无S/S文件）

1997-08-01

现行

MIL MIL-S-13949/13C Notice 2-Cancellation

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GI (WOVEN E-GLASS REINFORCEMENT, POLYIMIDE RESIN) (SUPERSEDING MIL-S-13949/13B) (NO S/S DOCUMENT)
片材、印刷线路板、预浸料、基材GI（编织电子玻璃增强材料、聚酰亚胺树脂）（取代MIL-S-13949/13B）（无S/S文件）

1998-11-30

现行

MIL MIL-S-13949/13C

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GI (WOVEN E-GLASS REINFORCEMENT, POLYIMIDE RESIN) (SUPERSEDING MIL-S-13949/13B) (NO S/S DOCUMENT)
薄板、印刷线路板、预浸料、基材GI（编织E玻璃增强、聚酰亚胺树脂）（替代MIL-S-13949/13B）（无S/S文件）

1993-08-06

现行

MIL MIL-S-13949/26A Notice 1-Inactivation

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GM (WOVEN E-GLASS REINFORCEMENT, TRIAZINE AND OR BISMALEIMIDE MODIFIED EPOXY RESIN) (SUPERSEDING MIL-S-13949/26) (NO S/S DOCUMENT)
片材、印刷线路板、预浸料、基材GM（编织电子玻璃增强材料、三嗪和/或双马来酰亚胺改性环氧树脂）（取代MIL-S-13949/26）（无S/S文件）

1997-08-01

现行

MIL MIL-S-13949/26A

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GM (WOVEN E-GLASS REINFORCEMENT, TRIAZINE AND OR BISMALEIMIDE MODIFIED EPOXY RESIN) (SUPERSEDING MIL-S-13949/26) (NO S/S DOCUMENT)
薄板、印刷线路板、预浸料、基材GM（编织E-玻璃增强、三嗪和/或双马来酰亚胺改性环氧树脂）（取代MIL-S-13949/26）（无S/S文件）

1993-04-11

现行

MIL MIL-S-13949/12B Notice 1-Inactivation

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GF (WOVEN E-GLASS REINFORCEMENT, MAJORITY DIFUNCTIONAL EPOXY RESIN, FLAME RESISTANT) (SUPERSEDING MIL-S-13949/12A) (NO S/S DOCUMENT)
片材 印刷线路板 预浸料 基材GF（编织电子玻璃增强材料 多数双功能环氧树脂 阻燃）（取代MIL-S-13949/12A）（无文件）

1997-08-01

现行

MIL MIL-S-13949/12B

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GF (WOVEN E-GLASS REINFORCEMENT, MAJORITY DIFUNCTIONAL EPOXY RESIN, FLAME RESISTANT) (SUPERSEDING MIL-S-13949/12A) (NO S/S DOCUMENT)
板材、印刷线路板、预浸料、基材GF（编织E-玻璃增强、多数双功能环氧树脂、阻燃）（替代MIL-S-13949/12A）（无S/S文件）

1993-08-16

现行

MIL MIL-S-13949/30A

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GC (WOVEN E-GLASS REINFORCEMENT, MAJORITY CYANATE ESTER RESIN, FLAME RESISTANT) (SUPERSEDING MIL-S-13949/30) (NO S/S DOCUMENT)
板材、印刷线路板、预浸料、基材GC（编织E玻璃增强、多数氰酸酯树脂、阻燃）（替代MIL-S-13949/30）（无S/S文件）

1993-05-18

现行

MIL MIL-S-13949/18A Notice 1-Inactivation

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GH (WOVEN E-GLASS REINFORCEMENT, MAJORITY POLYFUNCTIONAL EPOXY RESIN, HOT STRENGTH RETENTION, FLAME RESISTANT) (SUPERSEDING MIL-S-13949/18) (NO S/S DOCUMENT)
片材、印刷线路板、预浸料、基材GH（编织电子玻璃增强材料、多数多功能环氧树脂、热强度保持性、阻燃性）（取代MIL-S-13949/18）（无文件）

1997-08-01

现行

MIL MIL-S-13949/18A Notice 2-Cancellation

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GH (WOVEN E-GLASS REINFORCEMENT, MAJORITY POLYFUNCTIONAL EPOXY RESIN, HOT STRENGTH RETENTION, FLAME RESISTANT) (SUPERSEDING MIL-S-13949/18) (NO S/S DOCUMENT)
片材、印刷线路板、预浸料、基材GH（编织电子玻璃增强材料、多数多功能环氧树脂、热强度保持性、阻燃性）（取代MIL-S-13949/18）（无文件）

1998-11-30

现行

MIL MIL-S-13949/18A

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GH (WOVEN E-GLASS REINFORCEMENT, MAJORITY POLYFUNCTIONAL EPOXY RESIN, HOT STRENGTH RETENTION, FLAME RESISTANT) (SUPERSEDING MIL-S-13949/18) (NO S/S DOCUMENT)
板材、印刷线路板、预浸料、基材GH（编织E玻璃增强、多数多功能环氧树脂、热强度保持、阻燃）（替代MIL-S-13949/18）（无S/S文件）

1993-08-06

现行

MIL MIL-S-13949/20A Notice 1-Inactivation

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL QI (WOVEN QUARTZ REINFORCEMENT, POLYIMIDE RESIN) (SUPERSEDING MIL-S-13949/20) (NO S/S DOCUMENT)
片材、印刷线路板、预浸料、基材QI（编织石英增强材料、聚酰亚胺树脂）（替代MIL-S-13949/20）（无S/S文件）

1997-08-01

现行

MIL MIL-S-13949/20A Notice 2-Cancellation

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL QI (WOVEN QUARTZ REINFORCEMENT, POLYIMIDE RESIN) (SUPERSEDING MIL-S-13949/20) (NO S/S DOCUMENT)
片材、印刷线路板、预浸料、基材QI（编织石英增强材料、聚酰亚胺树脂）（替代MIL-S-13949/20）（无S/S文件）

1998-11-30

现行

MIL MIL-S-13949/20A

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL QI (WOVEN QUARTZ REINFORCEMENT, POLYIMIDE RESIN) (SUPERSEDING MIL-S-13949/20) (NO S/S DOCUMENT)
薄板、印刷线路板、预浸料、基材QI（编织石英增强、聚酰亚胺树脂）（替代MIL-S-13949/20）（无S/S文件）

1993-12-06

现行

MIL MIL-S-13949/16B Notice 1-Inactivation

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL AF (WOVEN ARAMID REINFORCEMENT, EPOXY RESIN, FLAME RESISTANT) (SUPERSEDING MIL-S-13949/16A) (NO S/S DOCUMENT)
片材、印刷线路板、预浸料、基材AF（芳纶编织增强材料、环氧树脂、阻燃）（取代MIL-S-13949/16A）（无文件）

1997-08-01

现行

MIL MIL-S-13949/16B Notice 2-Cancellation

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL AF (WOVEN ARAMID REINFORCEMENT, EPOXY RESIN, FLAME RESISTANT) (SUPERSEDING MIL-S-13949/16A) (NO S/S DOCUMENT)
片材、印刷线路板、预浸料、基材AF（芳纶编织增强材料、环氧树脂、阻燃）（取代MIL-S-13949/16A）（无文件）

1998-11-30

现行

MIL MIL-S-13949/16B

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL AF (WOVEN ARAMID REINFORCEMENT, EPOXY RESIN, FLAME RESISTANT) (SUPERSEDING MIL-S-13949/16A) (NO S/S DOCUMENT)
板材、印刷线路板、预浸料、基材AF（编织芳纶增强、环氧树脂、阻燃）（替代MIL-S-13949/16A）（无S/S文件）

1993-03-28

现行

BS EN 61249-2-6-2003

Materials for printed boards and other interconnecting structures-Reinforced base materials, clad and unclad-Brominated epoxide non-woven/woven E-glass glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
印制板和其他互连结构用材料 加固基材 包覆和未包覆 规定可燃性的包铜溴化环氧无纺/编织E玻璃纤维增强层压板（垂直燃烧试验）

2006-08-31

现行

MIL MIL-P-13949/3B Notice 1-Cancellation

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GE, GLASS BASE, WOVEN, MAJORITY DIFUNCTIONAL EPOXY RESIN, GENERAL PURPOSE, COPPER-CLAD (SUPERSEDING MIL-P-13949/3A) (S/S BY MIL-P-13949/4C)
层压塑料片 金属覆层（用于印刷线路板） 基材GE 玻璃基 编织 大多数双功能环氧树脂 通用 覆铜（取代MIL-P-13949/3A）（S/S BY MIL-P-1394.9/4C）

1988-06-14