目前，集成电路（IC）等电子行业主要由台湾的高科技原始设备制造商（OEM）和原始设计制造商（ODM）组成。电子IC产业不仅是资本和技术密集型产业，而且是能源密集型产业。自1997年12月京都全球变暖会议以来，理解和减少工业过程中的二氧化碳（CO2）排放已成为一个重要问题。本研究的目标是通过从集成电路行业获取特定的能源消耗数据来开发参考信息，这些数据可供各行业、工厂建设者、能源公司和政府机构用于确定集成电路行业的机会并提高能源效率。具体而言，本研究侧重于集成电路行业中两个部门的SEC——集成电路组装和测试，这是集成电路制造的后端阶段。 我们通过对选定的一组制造厂（以下简称“工厂”）在其最大产能下的能耗数据进行基准测试，量化了SEC水平，该产能被定义为工厂在现有资源的正常条件下能够生产的最大产量。工厂的“产能利用率”是指实际总产量与最大产能的比率。在这项研究中，11家晶圆厂的总产能占台湾IC产业总产能的60%以上。我们发现，在所有参与的IC A/T晶圆厂中，设施系统和工艺工具分别占功耗的53%和47%。IC A/T晶圆厂的平均冷负荷范围为0.09至0.31 USRT/m2。对于所研究的集成电路组装厂，当其产能利用率为100%时，SEC从21.2 kWh/k件到119.4 kWh/k件不等，平均为48.1 kWh/k件。 对于所研究的IC测试晶圆厂，当其容量利用率为100%时，SEC的范围为76.3 kWh/k片到201.1 kWh/k片，平均值为122.2 kWh/k片。我们估计，如果台湾所有的IC A/T晶圆厂达到本文研究的11家被调查晶圆厂中表现最好的晶圆厂的比能耗水平（即最低SEC水平），台湾IC A/T产业的年节能和二氧化碳减排量预计将分别达到25884.7万千瓦时/年和164886吨。此外，还提出了一种创新的洁净室通风系统节能设计，以节省IC A/T工厂的能源使用。更好的设计和控制可以使风扇节能20%以上。单位:SICitation:ASHRAE Transactions，第115卷，pt。2、路易斯维尔2009

Currently, the electronics industry such as integrated circuit (IC) industry is primarily composed of high-tech Original Equipment Manufacturers (OEM) and Original Design Manufacturers (ODM) in Taiwan. The electronics IC industry is not only capital- and technology-intensive, but also energy-intensive. Since the Kyoto Global Warming Conference in December 1997, understanding and mitigating the emission of carbon dioxide (CO2) from industrial processes has become an important issue. The goals of this study are to develop referencing information by obtaining specific energy consumption data from the IC industry, which can be used by the industries, plant builders, energy companies, and government agencies to identify opportunities and enhance energy efficiency in the IC industry. Specifically, this study focuses on SEC for two sectors in the IC industry - the IC assembly and testing that are the back-end stage processes in IC manufacturing. We quantified levels of SEC through benchmarking the energy consumption data for a selected group of fabrication plants (hereafter referred to as "fabs") at their maximal capacity, which was defined as the greatest number of output that the fab can produce under normal conditions with existing resources. The "capacity utilization" of a fab refers to the ratio of actual total output to the maximal capacity. In this study, the total 11 fabs’ capacity accounts for more than 60% of the total national capacity for IC industry in Taiwan. We have found that facility systems and process tools shared the major portion of the power consumption by 53% and 47% respectively in all participated IC A/T fabs. The average cooling load of the IC A/T fabs ranged from 0.09 to 0.31 USRT/m2. For IC assembly fabs studied, when their capacity utilization were 100%, the SEC ranged from 21.2 kWh/k pieces to 119.4 kWh/k pieces, with an average of 48.1 kWh/k pieces. For IC testing fabs studied, when their capacity utilization were 100%, the SEC ranged from 76.3 kWh/k pieces to 201.1 kWh/k pieces, with an average of 122.2 kWh/k pieces. We estimated that if all the IC A/T fabs in Taiwan achieved the level of specific energy consumption of the best performer (i.e., lowest SEC level) among the 11 surveyed fabs studied in this paper, the annual energy savings and of CO2-emission reduction from the IC A/T industry Taiwan would be expected to reach 258,847,000 kWh/year and 164,886 tons, respectively. In addition, an innovative energy efficient design of the cleanroom ventilation system is proposed to save energy use in the IC A/T fabs. A better design and control can save fan energy by more than 20%.Units: SI