Guide to the design and preparation of documentation for users of application software
应用软件用户文档设计和准备指南

1993-05-15

IEEE Guide for the Preparation of a Transmission Line Design Criteria Document
IEEE输电线路设计标准文件编制指南

2011-05-27

电子设备设计文件编制示例
Examples for preparation of design documents used in esectronic equipments

1996-07-22

Draft Document - Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals (IEC 47D/770/CD:2010)
文件草案.半导体器件的机械标准化.第6-1部分:表面安装半导体器件封装外形图绘制的一般规则.鸥翼引线端子的设计指南（IEC 47D/770/CD:2010）

2010-07-01

Draft Document - Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA) (IEC 47D/755/CD:2009)
文件草案.半导体器件的机械标准化.第6-5部分:表面安装半导体器件封装外形图绘制的一般规则.细间距球栅阵列（FBGA）的设计指南（IEC 47D/755/CD:2009）

2010-01-01

Draft Document - Fibre optic active components and devices - Package and interface standards - Part 21: Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA) (IEC 86C/1684/CDV:2020); English version prEN
文件草案——光纤有源元件和器件——封装和接口标准——第21部分:使用硅细间距球栅阵列（S-FBGA）和硅细间距地栅阵列（S-FLGA）的PIC封装电气接口设计指南（IEC 86C/1684/CDV:2020）；英文版

2021-07-01