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Soft solder alloys — Chemical compositions and forms 软焊合金 - 化学成分和形式
发布日期: 2020-09-24
本文件规定了含锡、铅、锑、铜、银、铋、锌、铟和/或镉两种或两种以上软钎料合金的化学成分要求。 还包括对一般可用表格的说明。
This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium. An indication of the forms generally available is also included.
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归口单位: ISO/TC 44/SC 12
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