邮件和快件投递状态分类与代码
Specifications for classification and coding of delivery statuses of mail and express items

2015-03-31

Mechanical standardization of semiconductor devices-Coding system and classification into forms of package outlines for semiconductor device packages
半导体器件的机械标准化

2018-05-30

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
半导体器件的机械标准化第4部分:半导体器件封装外形的编码系统和分类

2018-03-27

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
半导体器件的机械标准化 - 第4部分:编码系统和分类为半导体器件封装的封装轮廓形式

2013-10-10

Mechanical standardization of semiconductor devices -- Part 4: Coding system and classification into forms of package outlines for semiconductor device packages.
半导体器件机械标准化第4部分:半导体器件封装外形的编码系统和分类

2001-01-23

半导体器件的机械标准化 第4部分：半导体器件封装外形的分类和编码体系
Mechanical standardization of semiconductor devices—Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

2019-08-30

Amendment 1 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
修改件1.半导体器件的机械标准化.第4部分:半导体器件封装外形的编码系统和分类

2018-03-27

半导体器件的机械标准化 第４部分：半导体器件封装外形图类型的划分以及编号体系
Mechanical standardization of semiconductor devices--Part 4: Coding system and classification into forms of package outlines for semiconductor devices

1987-09-14

Draft Document - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 47D/769/CD:2010)
文件草稿.半导体器件的机械标准化.第4部分:半导体器件封装外形的编码系统和分类形式（IEC 47D/769/CD:2010）

2010-07-01