Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys (IEC 61189-11:2013); German version EN 61189-11:2013
电气材料、印制板和其他互连结构和组件的试验方法.第11部分:焊接合金熔化温度或熔化温度范围的测量（IEC 61189-11-2013）；德文版EN 61189-11:2013

2014-02-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures (IEC 61189-2:2006); German version EN 61189-2:2006
电气材料、印制板和其他互连结构和组件的试验方法.第2部分:互连结构材料的试验方法（IEC 61189-2-2006）；德文版EN 61189-2:2006

2007-01-01

Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies (IEC 61189-6:2006); German version EN 61189-6:2006
电气材料、互连结构和组件的试验方法.第6部分:制造电子组件用材料的试验方法（IEC 61189-6-2006）；德文版EN 61189-6:2006

2007-03-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) (IEC 61189-3:2007); German version EN 61189-3:2008
电气材料、印制板和其他互连结构和组件的试验方法.第3部分:互连结构（印制板）的试验方法（IEC 61189-3-2007）；德文版EN 61189-3:2008

2008-06-01

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning (IEC 61189-2-630:2018); German version EN IEC 61189-2-630:2018
电气材料、印制板和其他互连结构和组件的试验方法.第2-630部分:互连结构材料的试验方法.压力容器调节后的吸湿性（IEC 61189-2-630-2018）；德国版本EN IEC 61189-2-630:2018

2019-03-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 1: General test methods and methodology (IEC 61189-1:1997 + A1:2001); German version EN 61189-1:1997 + A1:2001
电气材料、印制板和其他互连结构和组件的试验方法.第1部分:一般试验方法和方法（IEC 61189-1-1997+A1-2001）；德文版EN 61189-1:1997+A1:2001

2002-04-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz) (IEC 61189-2-719:2016); German version EN 61189-2-719:2016
电气材料、印制板和其他互连结构和组件的试验方法.第2-719部分:互连结构材料的试验方法.相对介电常数和损耗正切（500MHz至10GHz）（IEC 61189-2-719-2016）；德文版EN 61189-2-719:2016

2017-04-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies (IEC 61189-5-1:2016); German version EN 61189-5-1:2016
电气材料、印制板和其他互连结构和组件的试验方法.第5-1部分:材料和组件的一般试验方法.印制板组件指南（IEC 61189-5-1-2016）；德文版EN 61189-5-1:2016

2017-04-01

IEC 61189-5, Ed. 1. Test methods for electrical materials, interconnection structures and assemblies. Part 5: Test methods for printed board assemblies
IEC 61189-5 第1版 电气材料、互连结构和组件的试验方法 第5部分:印制板组件的试验方法

2002-06-06

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT) (IEC 61189-5-504:2020); German version EN IEC 61189-5-504:2020
电气材料、印制板和其他互连结构和组件的试验方法.第5-504部分:材料和组件的一般试验方法.过程离子污染试验（PICT）（IEC 61189-5-504-2020）；德国版本EN IEC 61189-5-504:2020

2021-09-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies (IEC 61189-5-2:2015); German version EN 61189-5-2:2015
电气材料、印制板和其他互连结构和组件的试验方法.第5-2部分:材料和组件的一般试验方法.印制板组件的助焊剂（IEC 61189-5-2-2015）；德文版EN 61189-5-2:2015

2015-11-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies (IEC 61189-5-3:2015); German version EN 61189-5-3:2015
电气材料、印制板和其他互连结构和组件的试验方法.第5-3部分:材料和组件的一般试验方法.印制板组件用焊膏（IEC 61189-5-3-2015）；德文版EN 61189-5-3:2015

2015-11-01

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards (IEC 61189-5-503:2017); German version EN 61189-5-503:2017
电气材料、印制板和其他互连结构和组件的试验方法——第5-503部分:材料和组件的通用试验方法——电路板的导电阳极丝（CAF）试验（IEC 61189-5-503-2017）；德文版EN 61189-5-503:2017

2018-01-01

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of assemblies (IEC 61189-5-502:2021); German version EN IEC 61189-5-502:2021
电气材料、印制板和其他互连结构和组件的试验方法.第5-502部分:材料和组件的一般试验方法.组件的表面绝缘电阻（SIR）试验（IEC 61189-5-502:2021）；德国版本EN IEC 61189-5-502:2021

2022-05-01

Draft Document - Amendment 2 to IEC 61189-3: Test methods for electrical material, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (IEC 91/314/CD:2002)
文件草案——IEC 61189-3修正案2:电气材料、互连结构和组件的试验方法——第3部分:互连结构的试验方法（IEC 91/314/CD:2002）

2002-11-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator (IEC 61189-2-721:2015); German version EN 61189-2-721:2015
电气材料、印制板和其他互连结构和组件的试验方法第2-721部分:互连结构材料的试验方法用分裂柱d测量微波频率下覆铜板的相对介电常数和损耗正切

2016-03-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling (IEC 61189-3-719:2016); German version EN 61189-3-719:2016
电气材料、印制板和其他互连结构和组件的试验方法.第3-719部分:互连结构（印制板）的试验方法.温度循环期间单镀通孔（PTH）电阻变化的监测（IEC 61189-3-719-2016）；G

2016-12-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies (IEC 61189-5-4:2015); German version EN 61189-5-4:2015
电气材料、印制板和其他互连结构和组件的试验方法.第5-4部分:材料和组件的一般试验方法.印制板组件用焊料合金、熔剂和非熔剂实心线（IEC 61189-5-4-2015）；德文版EN 61189-5-4:

2015-11-01

BS EN 62047-11. Semiconductor devices. Micro-electromechanical devices. Part 11. Test method for linear thermal expansion coefficients of MEMS materials
英国标准EN 62047-11 半导体器件 微型机电设备 第11部分 MEMS材料线性热膨胀系数的试验方法

2010-03-11

Insulating and sheathing materials of electric cables. Test methods used in the United Kingdom but not specified in BS EN 60811-Electrical tests
电缆的绝缘和护套材料 英国使用但未在BS EN 60811中规定的试验方法

2006-01-20