现行

NY/T 2375-2013

食用菌生产技术规范
Production technical practice for edible mushrooms

2013-05-20

现行

NY/T 3220-2018

食用菌包装及贮运技术规范
Technical code of practice for packaging,storage and transportation of edible fungi

2018-03-15

现行

NY/T 528-2010

食用菌菌种生产技术规程
Code of practice for spawn production of edible mushroom

2010-05-20

现行

NY/T 3819-2020

农产品质量安全追溯操作规程 食用菌
Code of practice for quality and safety traceability of agricultural products-Edible mushroom

2020-11-12

现行

BS PD CLC/TR 62258-3-2007

Semiconductor die products-Recommendations for good practice in handling, packing and storage
半导体模具产品 搬运、包装和储存方面的良好实践建议

2008-05-31

现行

BS PD IEC/TR 62258-3-2005

Semiconductor die products. Recommendations for good practice in handling, packing and storage
半导体模具产品 搬运、包装和储存方面的良好实践建议

2005-12-07

现行

ASTM D8557-24

Standard Guide for Good Manufacturing Practices (GMPs) for Cannabis/Hemp-Containing Edibles, Dietary Supplements, Topicals, and Inhaled Products
含大麻/大麻的食品、膳食补充剂、外用药和吸入产品的良好生产规范（GMP）标准指南

2024-07-01

现行

KS T 1342(2018 Confirm)

보관중의 식음료품에 대한 포장효과이 표준측정 방법
保管中对食品饮料的包装效果是标准测量方法

2003-03-17

现行

KS T 1342(2023 Confirm)

보관중의 식음료품에 대한 포장효과이 표준측정 방법
食品和饮料产品储存期间包装效果测定的标准实施规程

2003-03-17

现行

ASTM E460-21

Standard Practice for Determining Effect of Packaging on Food and Beverage Products During Storage
确定包装对食品和饮料产品储存期间影响的标准实践

2021-01-01

现行

IEC TR 62258-3-2010

Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage
半导体模具产品.第3部分:搬运、包装和储存的良好实践建议

2010-08-06

现行

SY/T 7370-2017

地下储气库注采管柱选用与设计推荐作法
Recommended practice for selection and design of the injection-production tubing string in underground gas storage well

2017-03-28

现行

ASTM E2839-21

Standard Practice for Production and Storage of Spores of C. difficile for Use in Efficacy Evaluation of Antimicrobial Agents
生产和储存C孢子的标准实施规程 难辨药用于抗菌药物疗效评估

2021-06-01

现行

DIN IEC 62258-3-DRAFT

Draft Document - Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage (IEC 47/1750/CD:2004)
文件草稿.半导体模具产品.第3部分:搬运、包装和储存的良好实践建议（IEC 47/1750/CD:2004）

2004-06-01