IEC 61189-5-301:2021规定了使用细焊料颗粒测试焊膏（以下简称焊膏）特性的方法。 本文件适用于使用IEC 61190-1-2中规定的6型、7型或更细粒度焊料颗粒的焊膏。 这种类型的焊膏用于连接电子或通信设备等中使用的高密度印刷电路板中的布线和部件，配备精细布线(例如，最小导体宽度和最小导体间隙为60 μ m或更小)。 本文中的焊膏特性测试方法考虑了由于焊料颗粒尺寸较小而产生的表面活化力的影响，这可能会影响现有测试方法的测试结果。

IEC 61189-5-301:2021 specifies methods for testing the characteristics of soldering paste using fine solder particles (hereinafter referred to as solder paste).
This document is applicable to the solder paste using fine solder particle such as type 6, type 7 specified in IEC 61190-1-2 or finer particle sizes.
This type of solder paste is used for connecting wiring and components in high-density printed circuit boards which are used in electronic or communication equipment and such, equipping fine wiring (e.g., minimum conductor widths and minimum conductor gaps of 60 μm or less).
Test methods for the characteristics of solder paste in this document are considering the effect of surface activation force due to the fine sized solder particles which could affect the test result by existing test methods.