SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL QI (WOVEN QUARTZ REINFORCEMENT, POLYIMIDE RESIN) (SUPERSEDING MIL-S-13949/20) (NO S/S DOCUMENT)
片材、印刷线路板、预浸料、基材QI（编织石英增强材料、聚酰亚胺树脂）（替代MIL-S-13949/20）（无S/S文件）

1997-08-01

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL QI (WOVEN QUARTZ REINFORCEMENT, POLYIMIDE RESIN) (SUPERSEDING MIL-S-13949/20) (NO S/S DOCUMENT)
片材、印刷线路板、预浸料、基材QI（编织石英增强材料、聚酰亚胺树脂）（替代MIL-S-13949/20）（无S/S文件）

1998-11-30

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL QI (WOVEN QUARTZ REINFORCEMENT, POLYIMIDE RESIN) (SUPERSEDING MIL-S-13949/20) (NO S/S DOCUMENT)
薄板、印刷线路板、预浸料、基材QI（编织石英增强、聚酰亚胺树脂）（替代MIL-S-13949/20）（无S/S文件）

1993-12-06

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL QI (WOVEN QUARTZ REINFORCEMENT, POLYIMIDE RESIN, HEAT RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/19) (NO S/S DOCUMENT)
片材 印刷线路板 层压 基材QI（编织石英增强 聚酰亚胺树脂 耐热 金属包覆或未包覆）（取代MIL-S-13949/19）（无S/S文件）

1997-08-01

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL QI (WOVEN QUARTZ REINFORCEMENT, POLYIMIDE RESIN, HEAT RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/19) (NO S/S DOCUMENT)
基材QI层压印刷线路板（编织石英增强、聚酰亚胺树脂、耐热、金属包覆或非包覆）（替代MIL-S-13949/19）（无S/S文件）

1993-12-06

PLASTIC SHEET, LAMINATED, MATERIALS (FOR PRINTED WIRING BOARDS), BASE MATERIAL, AI, ARAMID, WOVEN, MAJORITY POLYIMIDE, RESIN, PREIMPREGNATED (B-STAGE) (NO S/S DOCUMENT)
塑料片 层压 材料（用于印制线路板） 基材 AI 芳纶 机织 大部分聚酰亚胺 树脂 预浸渍（B级）（无S/S文件）

1994-01-25

Base materials for printed circuits -- Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed board
印制电路用基材多层印制板制造用规定可燃性的薄型聚酰亚胺编织玻璃纤维覆铜层压板

1999-01-01

Base materials for printed circuits -- Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
印制电路用基材多层印制板制造用规定可燃性的双马来酰亚胺/三嗪改性环氧玻璃纤维织物覆铜薄层压板

1999-01-01

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GT, GLASS BASE, WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, COPPER-CLAD (SUPERSEDING MIL-P-13949/8C) (NO S/S DOCUMENT)
层压金属覆塑料片（用于印刷线路板） 基材GT 玻璃基 编织聚四氟乙烯树脂 阻燃 覆铜（取代MIL-P-13949/8C）（无S/S文件）

1994-07-11

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GT, GLASS BASE, WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, COPPER-CLAD (SUPERSEDING MIL-P-13949/8C) (NO S/S DOCUMENT)
塑料片 层压材料 金属层（印刷线路板） 基材GT 玻璃基 WOVEN 聚四氟乙烯树脂 耐火树脂 铜箔（取代MIL-P-13949/8C）（NO S/S文件）

1988-03-28

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GT, GLASS BASE, WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, COPPER-CLAD (SUPERSEDING MIL-P-13949/8C) (NO S/S DOCUMENT)
覆铜箔阻燃聚四氟乙烯树脂编织玻璃基GT基材金属覆层层压塑料板（用于印制线路板）（代替MIL-P-13949/8C）（无S/S文件）

1988-03-28

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL BI (NONWOVEN ARAMID REINFORCEMENT, POLYIMIDE RESIN, METAL CLAD OR UNCLAD) (NO S/S DOCUMENT)
片材 印刷线路板 层压 基材BI（非织造芳纶增强材料 聚酰亚胺树脂 金属包覆或未包覆）（无S/S文件）

1997-08-01

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL BI (NONWOVEN ARAMID REINFORCEMENT, POLYIMIDE RESIN, METAL CLAD OR UNCLAD) (NO S/S DOCUMENT)
基材BI（非织造芳纶增强、聚酰亚胺树脂、金属包覆或非包覆）层压印刷线路板薄板（无S/S文件）

1994-03-17

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL AF (WOVEN ARAMID REINFORCEMENT, EPOXY RESIN, FLAME RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/15B) (NO S/S DOCUMENT)
（代替MIL-S-13949/15B）（不含S/S文件）的印刷线路板 层压基材（WOVEN ARAMID加固 环氧树脂 阻燃剂 金属粘合剂或包合物）

1997-08-01

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL AF (WOVEN ARAMID REINFORCEMENT, EPOXY RESIN, FLAME RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/15B) (NO S/S DOCUMENT)
层压印刷线路板片材 基材AF（芳纶增强编织物 环氧树脂 阻燃 金属包覆或未包覆）（取代MIL-S-13949/15B）（无S/S文件）

1998-11-30

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL AF (WOVEN ARAMID REINFORCEMENT, EPOXY RESIN, FLAME RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/15B) (NO S/S DOCUMENT)
基材AF层压印刷线路板（编织芳纶增强、环氧树脂、阻燃、金属包覆或非包覆）（替代MIL-S-13949/15B）（无S/S文件）

1993-03-28

Materials for printed boards and other interconnecting structures - Part 2-4: Reinforced base materials, clad and unclad - Polyester non-woven/woven fibreglass laminated sheet of defined flammability (vertical burning test), copper-clad
印刷电路板和其他互连结构材料 - 第2-4部分:强化基材 包层和未包覆 - 聚酯无纺布/编织玻璃纤维层压板（垂直燃烧试验） 铜包层

2001-12-19

Materials for printed boards and other interconnecting structures -- Part 2-4: Reinforced base materials, clad and unclad - Polyester non-woven/woven fibreglass laminated sheet of defined flammability (vertical burning test), copper-clad.
印制板和其他互连结构用材料第2-4部分:覆层和非覆层增强基材规定可燃性的覆铜聚酯非织造/机织玻璃纤维层压板（垂直燃烧试验）

2003-03-28

Материалы для печатных плат и других структур межсоединений. Часть 2-4. Материалы основания армированные, фольгированные и нефольгированные. Листы армированные слоистые на основе тканого или нетканого стекловолокна, пропитанного полиэфирным связующим, нормированной горючести (вертикальный тест горения), фольгированные медью
印刷板和其他互连结构的材料 第2-4部分 加强基材 包覆和不包括 聚酯无纺布/编织玻璃纤维层压板具有明确的易燃性（垂直燃烧试验） 铜包层

인쇄 회로 기판 재료－제2부：규격－ 제11장：다층 인쇄 회로 기판 제조용 일반 등급의 박막 에폭시 유리 섬유 직물 동 입힘 적층판
印制电路用基材第2部分:第11号规范:多层印制板制造用通用级薄环氧玻璃纤维布覆铜层压板

2002-08-31