인쇄기판 조립품－제2부：품종규격：표면실장 납땜 조립품에 대한 요구사항
印制板组件第2部分:分规范表面安装焊接组件的要求

2006-12-18

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
印刷电路板组件 - 第2部分:分段规格 - 表面安装焊接组件的要求

2017-05-23

印制板组装 第2部分: 分规范 表面安装焊接组装的要求
Printed board assemblies--Part 2: Sectional specification--Requirements for surface mount solderedassemblies

2003-07-02

인쇄기판조립품－제4부：품종 규격－단자가 납땜된 조립품에 대한 요구사항
印制板组件第4部分:分规范终端焊接组件要求

2007-11-29

인쇄기판조립품－제4부：품종 규격－단자가 납땜된 조립품에 대한 요구사항
印制板组件第4部分:分规范端子焊接组件的要求

2007-11-29

Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
印刷电路板组件 - 第4部分:部分规格 - 终端焊接组件的要求

2017-07-26

印制板组装 第4部分:分规范 引出端焊接组装的要求
Printed board assemblies--Part 4:Sectional specification--Requirements for terminal soldered assemblies

2003-11-24

인쇄기판 조립품－제3부：품종규격：관통구멍 실장 납땜 조립품에 대한 요구사항
印制板组件第3部分:分规范通孔安装焊接组件的要求

2006-12-18

인쇄회로기판 조립품 —제3부: 품목규격 — 스루홀 실장 솔더링 조립품에 대한 요구사항
印制板组件第3部分:分规范通孔安装焊接组件的要求

2021-12-02

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
印刷电路板组件 - 第3部分:分段规格 - 通孔安装焊接组件的要求

2017-05-30

印制板组装 第3部分:分规范 通孔安装焊接组装的要求
Printed board assemblies--Part 3:Sectional specification--Requirements for through-hole mount soldered assemblies

2003-11-24

Печатные узлы. Часть 3. Монтаж в сквозные отверстия. Технические требования
印刷板组件 第三部分 通孔安装焊接组件的要求

BS EN 61182-2-2. Printed board assembly products. Manufacturing description data and transfer technology. Part 2-2. Sectional requirements for implementation of printed board fabrication data description
英国标准EN 61182-2-2 印制板组装产品 制造描述数据和传输技术 第2-2部分 印制板制造数据说明实施的分要求

2009-12-23

IEC 2326-2. Printed boards. Part 2. Rigid single and double-sided printed boards without interlayer connections. Sectional specification. 52/674/CD
IEC 2326-2 印制板 第二部分 无夹层连接的刚性单面和双面印制板 分规范 52/674/CD

1996-10-15

Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description (IEC 61182-2-2:2012); German version EN 61182-2-2:2012
印制板组装产品.制造描述数据和传输方法.第2-2部分:印制板制造数据描述实施的分要求（IEC 61182-2-2-2012）；德文版EN 61182-2-2:2012

2013-08-01

IEC 1188-5-2. Design and use of printed boards and printed board assemblies. Part 5. Sectional design and use requirements. Attachment (land/joint) considerations. Section 2. Discrete components 52/573/CD. Components with Gull-wing leads on two sides
IEC 1188-5-2 印制板和印制板组件的设计和使用 第五部分 分段设计和使用要求 附件（土地/联合）注意事项 第二节 分立元件52/573/CD 两侧带有鸥翼引线的部件

1995-07-12

IEC 2326-2-1. Printed boards. Part 2. Rigid single and double sided printed boards without interlayer connections. Section 1. Capability detail specification. Performance level A, B and C. 52/674/CD. Capability detail specification - Performance levels A, B and C
IEC 2326-2-1 印制板 第二部分 无夹层连接的刚性单面和双面印制板 第一节 能力详细说明 A、B和C级性能52/674/CD 能力详细规范-性能等级A、B和C

1996-10-15

Fixed resistors for use in electronic equipment - Part 2: Sectional specification: Low-power film resistors with leads for through-hole assembly on circuit boards (THT)
电子设备用固定电阻器.第2部分:分规范:电路板通孔组件用带引线的低功率薄膜电阻器（THT）

2023-02-15

Materials for printed boards and other interconnecting structures - Part 4-2: Sectional specification set for prepreg materials, unclad - Multifunctional epoxide woven E-glass prepreg of defined flammability
印刷电路板及其他互连结构材料 - 第4-2部分:预浸材料的分段规格书 未包装 - 多功能环氧化物编织的易燃玻璃预浸料

2005-09-05

Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
印刷板和其他互连结构材料 - 第4-14部分:预浸料材料（用于制造多层板材）的环氧树脂编织的E玻璃预浸料（垂直燃烧试验）用于无铅装配

2009-05-26