Copper-clad laminates for printed wiring boards -- Synthetic fiber fabric base, epoxy resin
印制线路板用覆铜层压板合成纤维织物基环氧树脂

1997-01-01

Specifications-Metal-clad base materials for printed wiring boards. Copper-clad base material. Specification for epoxide cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test)
规格

2001-04-15

Materials for printed boards and other interconnecting structures-Reinforced base materials, clad and unclad. Phenolic cellulose paper reinforced laminated sheets, economic grade, copper-clad
印制板和其他互连结构用材料

2005-08-09

Materials for printed boards and other interconnecting structures-Reinforced base materials, clad and unclad-Phenolic cellulose paper reinforced laminated sheets, high electrical grade, copper-clad
印制板和其他互连结构用材料

2006-06-30

Materials for printed boards and other interconnecting structures-Reinforced base materials, clad and unclad-Non-halogenated phenolic cellulose paper reinforced laminated sheets, economic grade, copper-clad
印制板和其他互连结构用材料

2005-08-25

Materials for printed boards and other interconnecting structures - Part 2-1: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, economic grade, copper clad
印刷电路板及其他互连结构材料 - 第2-1部分:增强基材 包层和不包覆 - 酚醛纤维素纸增强层压板 经济级铜包层

2005-01-11

인쇄 회로 기판 및 기타 연결 구조 재료－제2－1부：동박 및 무동박 보강재－셀룰로오스 종이 기재 페놀 수지 동박 적층판, 경제적 등급
印制板和其他互连结构用材料第2－1部分:包层和非包层增强基材经济级包铜酚醛纤维素纸增强层压板

2006-12-26

인쇄 회로 기판 및 기타 연결 구조 재료－제2－1부：동박 및 무동박 보강재－셀룰로오스 종이 기재 페놀 수지 동박 적층판, 경제적 등급
印制板和其他互连结构用材料第2－1部分:包层和非包层增强基材经济级包铜酚醛纤维素纸增强层压板

2006-12-26

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GE, GLASS BASE, WOVEN, MAJORITY DIFUNCTIONAL EPOXY RESIN, GENERAL PURPOSE, COPPER-CLAD (SUPERSEDING MIL-P-13949/3A) (S/S BY MIL-P-13949/4C)
覆金属层压塑料板（用于印制线路板） 基材GE 玻璃基 机织 多功能环氧树脂 通用 覆铜（取代MIL-P-13949/3A）（S/S由MIL-P-13949/4C替代）

1987-02-11

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GE, GLASS BASE, WOVEN, MAJORITY DIFUNCTIONAL EPOXY RESIN, GENERAL PURPOSE, COPPER-CLAD (SUPERSEDING MIL-P-13949/3A) (S/S BY MIL-P-13949/4C)
层压塑料片 金属覆层（用于印刷线路板） 基材GE 玻璃基 编织 大多数双功能环氧树脂 通用 覆铜（取代MIL-P-13949/3A）（S/S BY MIL-P-1394.9/4C）

1988-06-14

회로기판 및 다른 내부 접속용 구조를 위한 재료 — 제2-2부: 강화 원자재, 덮임 및 비덮임 — 페놀수지를 적용한 셀룰로오스 종이 강화 시트, 고전기 등급, 동박 적층
印制板和其他互连结构用材料第2-2部分:覆层和非覆层增强基材覆铜高电气级酚醛纤维素纸增强层压板

2022-06-28

Materials for printed boards and other interconnecting structures - Part 2-2: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, high electrical grade, copper-clad
印刷电路板及其他互连结构材料 - 第2-2部分:强化基材 包层和不包覆 - 酚醛纤维素纸加强复合板 高电级 铜包层

2005-01-20

Материалы для печатных плат и других структур межсоединений. Часть 2-2. Материалы основания армированные фольгированные и нефольгированные. Листы армированные слоистые на основе целлюлозной бумаги, пропитанной фенольным связующим, фольгированные медью и обладающие высокими электрическими характеристиками
印刷板和其他互连结构的材料 第2-2部分 加强基材 包覆和不包括 酚醛纤维素纸增强层压板 铜包层和高电级

Materials for printed boards and other interconnecting structures - Part 2-23: Reinforced base materials, clad and unclad - Non-halogenated phenolic cellulose paper reinforced laminated sheets, economic grade, copper clad
印刷电路板及其他互连结构材料 - 第2-23部分:强化基材 包覆和非包覆 - 非卤化酚醛纤维素纸加强复合板 经济级铜包层

2005-01-11

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GT, GLASS BASE, WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, COPPER-CLAD (SUPERSEDING MIL-P-13949/8C) (NO S/S DOCUMENT)
覆铜箔阻燃聚四氟乙烯树脂编织玻璃基GT基材金属覆层层压塑料板（用于印制线路板）（代替MIL-P-13949/8C）（无S/S文件）

1988-03-28

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GT, GLASS BASE, WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, COPPER-CLAD (SUPERSEDING MIL-P-13949/8C) (NO S/S DOCUMENT)
层压金属覆塑料片（用于印刷线路板） 基材GT 玻璃基 编织聚四氟乙烯树脂 阻燃 覆铜（取代MIL-P-13949/8C）（无S/S文件）

1994-07-11

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GT, GLASS BASE, WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, COPPER-CLAD (SUPERSEDING MIL-P-13949/8C) (NO S/S DOCUMENT)
塑料片 层压材料 金属层（印刷线路板） 基材GT 玻璃基 WOVEN 聚四氟乙烯树脂 耐火树脂 铜箔（取代MIL-P-13949/8C）（NO S/S文件）

1988-03-28

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL BF (NONWOVEN ARAMID REINFORCEMENT, EPOXY RESIN, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/22A) (NO S/S DOCUMENT)
基材BF层压印刷线路板（非纺织芳纶增强、环氧树脂、金属包覆或非包覆）（替代MIL-S-13949/22A）（无S/S文件）

1993-01-25

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL BF (NONWOVEN ARAMID REINFORCEMENT, EPOXY RESIN, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/22A) (NO S/S DOCUMENT)
片状印刷线路板 层压 基材BF（无纺芳纶增强材料 环氧树脂 金属包覆或未包覆）（取代MIL-S-13949/22A）（无文件）

1997-08-01

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL BF (NONWOVEN ARAMID REINFORCEMENT, EPOXY RESIN, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/22A) (NO S/S DOCUMENT)
片状印刷线路板 层压 基材BF（无纺芳纶增强材料 环氧树脂 金属包覆或未包覆）（取代MIL-S-13949/22A）（无文件）

1998-11-30