GB/T 4588.10-1995-印制板第10部分:有贯穿连接的刚挠双面印制板规范-国家数字标准馆

现行 GB/T 4588.10-1995

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印制板第10部分:有贯穿连接的刚挠双面印制板规范 Printed boards--Part 10:Specification for flex-rigid double-sided printed boards with through connections

发布日期： 1995-12-21

实施日期： 1996-08-01

分类信息

发布单位或类别：中国-国家标准

CCS分类： L30电子元器件与信息技术 - 电子元件 - 印制电路

ICS分类： 31.180电子学 - 印制电路和印制电路板

关联关系

研制信息

归口单位：全国印制电路标准化技术委员会

起草单位：上海无线电二十厂

起草人：徐吉兰、郑彩娟

相似标准/计划/法规

现行

BS 6221-10-1991

Printed wiring boards-Specification for flex-rigid double-sided printed boards with through connections
印刷线路板带贯穿连接的挠性-刚性双面印制板规范

1991-09-30

现行

BS 123700-2001

System of quality assessment. Sectional specification. Flex-rigid double-sided printed boards with through-connections
质量评估体系分规范带贯穿连接的挠性刚性双面印制板

2001-12-17

现行

BS 123700-003-2001

System of quality assessment. Capability detail specification. Flex-rigid double-sided printed boards with through-connections
质量评估体系能力详细说明带贯穿连接的挠性刚性双面印制板

2001-12-17

现行

DIN EN 123700

Sectional specification - Flex-rigid double sided printed boards with through connections; German version EN 123700:1996
分规范.带贯穿连接的柔性-刚性双面印制板；德文版EN 123700:1996

1997-10-01

现行

BS EN 123700-1997

Harmonized system of quality assessment for electronic components. Sectional specification. Flex-rigid double sided printed boards with through connections
电子元件质量评定协调体系分规范带贯穿连接的刚柔双面印制板

1997-05-15

现行

BS CECC 23700-801-1998

Harmonized system of quality assessment for electronic components. Capability detail specification: flex-rigid double-sided printed boards with through connections
电子元件质量评定协调体系性能详细规范:带贯穿连接的挠性-刚性双面印制板

1998-06-15

现行

BS 96/213356 DC

IEC 2326-3. Printed boards. Part 3. Rigid single and double sided printed boards with interlayer connections. Sectional specification. 52/676/CD
IEC 2326-3 印制板第三部分带有夹层连接的刚性单面和双面印制板分规范 52/676/CD

1996-10-15

现行

BS 96/213354 DC

IEC 2326-2. Printed boards. Part 2. Rigid single and double-sided printed boards without interlayer connections. Sectional specification. 52/674/CD
IEC 2326-2 印制板第二部分无夹层连接的刚性单面和双面印制板分规范 52/674/CD

1996-10-15

现行

BS 96/213357 DC

IEC 2326-3-1. Printed boards. Part 3. Rigid single and double sided printed boards with interlayer connections. Section 1. Capability detail specification. Performance level A, B, and C. 52/677/CD. Capability detail specification - Performance levels A, B and C
IEC 2326-3-1 印制板第三部分带有夹层连接的刚性单面和双面印制板第一节能力详细说明性能等级A、B和C 52/677/CD 能力详细规范-性能等级A、B和C

1996-10-15

现行

BS 96/213355 DC

IEC 2326-2-1. Printed boards. Part 2. Rigid single and double sided printed boards without interlayer connections. Section 1. Capability detail specification. Performance level A, B and C. 52/674/CD. Capability detail specification - Performance levels A, B and C
IEC 2326-2-1 印制板第二部分无夹层连接的刚性单面和双面印制板第一节能力详细说明 A、B和C级性能52/674/CD 能力详细规范-性能等级A、B和C

1996-10-15