IEC 60068-2-20:20 21作为IEC 60068-2-20:20 21 RLV提供，其中包含国际标准及其红线版本，显示了与上一版本相比技术内容的所有变化。IEC 60068-2-20:20 21概述了测试Ta和Tb，适用于带导线的设备和导线本身。IEC 60068？中描述了表面贴装器件（SMD）的焊接测试？2？58.本文件提供了在使用焊料合金(共晶或近共晶锡铅(Pb))或无铅合金的应用中测定器件的可焊性和耐焊接热性的程序。本文件中的程序包括焊料槽法和烙铁法。本文件的目的是确保元件引线或终端的可焊性符合IEC 61191-的适用焊点要求。3和IEC 61191-4。此外，提供了测试方法以确保部件本体能够抵抗其在焊接期间所暴露的热负荷。与上一版相比，此版本包括以下重大技术变更: -更新和澄清预处理（以前的“老化”）及其与自然老化的关系。

IEC 60068-2-20:2021 is available as IEC 60068-2-20:2021 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.

IEC 60068-2-20:2021 outlines Tests Ta and Tb, applicable to devices with leads and leads themselves. Soldering tests for surface mounting devices (SMD) are described in IEC 60068？2？58. This document provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys. The procedures in this document include the solder bath method and soldering iron method. The objective of this document is to ensure that component lead or termination solderability meets the applicable solder joint requirements of IEC 61191-3 and IEC 61191-4. In addition, test methods are provided to ensure that the component body can be resistant to the heat load to which it is exposed during soldering. This edition includes the following significant technical changes with respect to the previous edition:
- update of and clarification of pre-conditioning (former "aging") and its relation to natural aging.