本文件为马歇尔航天飞行中心（MSFC）制造的设备和元件的半永久性金属对金属接头（通过螺栓、铆钉、夹具等连接在一起的接头）的电气连接以及间接连接所涉及的工艺制定了标准。有两种类型的电键:直接键和间接键。直接连接是通过焊接、铆接或螺栓连接提供的金属对金属接头。间接连接通过皮带或跳线连接。焊接、钎焊或出汗形成的接头本质上是粘合的，前提是遵循适当的程序，以确保接头中没有杂质或缺陷。

This document establishes criteria for the processes involved in electrical bonding of semi-permanent, metal-to-metal joints (joints held together by bolts, rivets, clamps, etc.) and indirect bonds for equipment and elements manufactured at the Marshall Space Flight Center (MSFC). There are two types of electrical bonds: direct and indirect. Direct bonds are metal-to-metal joints provided by welding, riveting or bolting. Indirect bonds are connected through a strap or jumper. Joints formed by welding, brazing or sweating are inherently bonded provided that proper procedures are followed to ensure no impurities or imperfections are incorporated in the joint.