MIL MIL-PRF-19500/350M-晶体管 PNP 硅低功率封装（通孔和表面安装封装）和非封装（芯片）辐射和非辐射硬化 2N3867、2N3868、JAN、JANTX、JANTXV、JANS、JANHC和JANKC型-国家数字标准馆

现行 MIL MIL-PRF-19500/350M

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Transistor, PNP, Silicon, Low Power Encapsulated (Through-Hole and Surface Mount Packages) and Un-Encapsulated (DIE), Radiation and Non-Radiation Hardened, Types 2N3867, 2N3868, JAN, JANTX, JANTXV, JANS, JANHC, and JANKC 晶体管 PNP 硅低功率封装（通孔和表面安装封装）和非封装（芯片）辐射和非辐射硬化 2N3867、2N3868、JAN、JANTX、JANTXV、JANS、JANHC和JANKC型

发布日期： 2015-08-31

本规范涵盖PNP、硅、开关晶体管的性能要求。为每种设备类型提供四个级别的产品保证（JAN、JANTX、JANTXV和JANS）。为每种未封装设备类型提供两级产品保证（JANHC和JANKC）。JANTXV、JANS、JANHC和JANKC产品保证等级提供了八个辐射等级的辐射硬度保证（RHA）规定。

This specification covers the performance requirements for PNP, silicon, switching transistor. Four levels of product assurance (JAN, JANTX, JANTXV, and JANS) are provided for each device type. Two levels of product assurance (JANHC and JANKC) are provided for each unencapsulated device type. Provisions for radiation hardness assurance (RHA) to eight radiation levels is provided for JANTXV, JANS, JANHC, and JANKC product assurance levels.

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发布单位或类别：美国-美国军事规范和标准

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