IEC 62899的本部分提供了测量印刷层剥离强度的试验方法 在柔性基板上。这种方法要求剥离柔性基板，而不是 在印刷层上进行额外的金属电镀。本文件中描述的方法 可用于比较同一柔性基板上印刷层的剥离强度 以及厚度条件。当印刷层和印刷体之间的附着力 柔性基板比印刷层和基板之间的任何其他界面都要弱 粘合剂、粘合剂和面板。购买本文件时可获得的所有当前修订均包含在购买本文件中。

This part of IEC 62899 provides a test method to measure the peel strength of a printed layer on a flexible substrate. This method calls for peeling the flexible substrate instead of an additional metal electroplating on the printed layer. The method described in this document can be used to compare the peel strengths of the printed layers on the same flexible substrate and thickness conditions. It can be used when the adhesion between the printed layer and flexible substrate is weaker than any other interface between the printed layer and the adhesive, the adhesive and the panel.All current amendments available at time of purchase are included with the purchase of this document.