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阻燃型铝基覆铜箔层压板规范 Specification for flame resistant Aluminum base Copper-clad laminated sheets
发布日期: 2000-10-20
实施日期: 2000-10-20
分类信息
发布单位或类别: 中国-行业标准-电子
关联关系
研制信息
相似标准/计划/法规
现行
MIL MIL-P-13949/8D Notice 1-Validation
PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GT, GLASS BASE, WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, COPPER-CLAD (SUPERSEDING MIL-P-13949/8C) (NO S/S DOCUMENT)
层压金属覆塑料片(用于印刷线路板) 基材GT 玻璃基 编织聚四氟乙烯树脂 阻燃 覆铜(取代MIL-P-13949/8C)(无S/S文件)
1994-07-11
现行
MIL MIL-P-13949/8D Notice 3-Cancellation
PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GT, GLASS BASE, WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, COPPER-CLAD (SUPERSEDING MIL-P-13949/8C) (NO S/S DOCUMENT)
塑料片 层压材料 金属层(印刷线路板) 基材GT 玻璃基 WOVEN 聚四氟乙烯树脂 耐火树脂 铜箔(取代MIL-P-13949/8C)(NO S/S文件)
1988-03-28
现行
MIL MIL-P-13949/8D
PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GT, GLASS BASE, WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, COPPER-CLAD (SUPERSEDING MIL-P-13949/8C) (NO S/S DOCUMENT)
覆铜箔阻燃聚四氟乙烯树脂编织玻璃基GT基材金属覆层层压塑料板(用于印制线路板)(代替MIL-P-13949/8C)(无S/S文件)
1988-03-28
现行
BS 4584-6-1972
Specification for metal-clad base materials for printed circuits-Phenolic cellulose paper copper-clad laminated sheet of medium electrical quality, flame retardant grade: PF-CP-Cu-6
印制电路用金属覆层基材规范 阻燃级中等电气质量酚醛纤维素纸覆铜层压板:PF-CP-Cu-6
1972-07-28
现行
MIL MIL-P-13949/6D Notice 1-Validation
PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GP, GLASS BASE, NON WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, COPPER-CLAD (SUPERSEDING MIL-P-13949/6C) (NO S/S DOCUMENT)
层压金属覆塑料片(用于印刷线路板) 基材GP 玻璃基 无纺布 聚四氟乙烯树脂 阻燃 覆铜(取代MIL-P-13949/6C)(无S/S文件)
1994-07-11
现行
MIL MIL-P-13949/6D Notice 3-Cancellation
PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GP, GLASS BASE, NON WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, COPPER-CLAD (SUPERSEDING MIL-P-13949/6C) (NO S/S DOCUMENT)
塑料片 层压材料 金属层(印刷线路板) 基材GP 玻璃基 非织造布 聚四氟乙烯树脂 耐火树脂 铜箔(取代MIL-P-13949/6C)(无S/S文件)
1987-02-11
现行
MIL MIL-P-13949/6D Notice 2-Inactivation
PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GP, GLASS BASE, NON WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, COPPER-CLAD (SUPERSEDING MIL-P-13949/6C) (NO S/S DOCUMENT)
层压金属覆塑料片(用于印刷线路板) 基材GP 玻璃基 无纺布 聚四氟乙烯树脂 阻燃 覆铜(取代MIL-P-13949/6C)(无S/S文件)
1997-08-01
现行
MIL MIL-P-13949/6D
PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GP, GLASS BASE, NON WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, COPPER-CLAD (SUPERSEDING MIL-P-13949/6C) (NO S/S DOCUMENT)
覆铜阻燃聚四氟乙烯树脂无纺布基材GP玻璃基金属覆层层压塑料板(用于印制线路板)(代替MIL-P-13949/6C)(无S/S文件)
1987-02-11
现行
MIL MIL-P-13949/7E Notice 1-Validation
PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GF, GLASS BASE, NONWOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, FOR MICROWAVE APPLICATION, COPPER-CLAD (SUPERSEDING MIL-P-13949/7D) (NO S/S DOCUMENT)
层压金属覆塑料片(用于印刷线路板) 基材GF 玻璃基 无纺 聚四氟乙烯树脂 阻燃 微波应用 覆铜(取代MIL-P-13949/7D)(无文件)
1994-07-11
现行
MIL MIL-P-13949/14A Notice 1-Validation
PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GY, GLASS BASE WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, FOR MICROWAVE APPLICATION, COPPER-CLAD (SUPERSEDING MIL-P-13949/14) (NO S/S DOCUMENT)
层压金属覆塑料片(用于印刷线路板) 基材GY 玻璃基编织 聚四氟乙烯树脂 阻燃 微波应用 覆铜(取代MIL-P-13949/14)(无S/S文件)
1994-07-11
现行
MIL MIL-P-13949/14A Notice 2-Inactivation
PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GY, GLASS BASE WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, FOR MICROWAVE APPLICATION, COPPER-CLAD (SUPERSEDING MIL-P-13949/14) (NO S/S DOCUMENT)
层压金属覆塑料片(用于印刷线路板) 基材GY 玻璃基编织 聚四氟乙烯树脂 阻燃 微波应用 覆铜(取代MIL-P-13949/14)(无S/S文件)
1997-08-01
现行
MIL MIL-P-13949/14A Notice 3-Cancellation
PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GY, GLASS BASE WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, FOR MICROWAVE APPLICATION, COPPER-CLAD (SUPERSEDING MIL-P-13949/14) (NO S/S DOCUMENT)
塑料板 层压板 金属层(印刷线路板) 基材GY 玻璃基板 聚四氟乙烯树脂 耐火材料 用于微波应用 铜箔(取代MIL-P-13949/14)(NO S/S文件)
1987-02-11
现行
MIL MIL-P-13949/7E Notice 02118-Cancellation
PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GF, GLASS BASE, NONWOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, FOR MICROWAVE APPLICATION, COPPER-CLAD (SUPERSEDING MIL-P-13949/7D) (NO S/S DOCUMENT)
层压金属覆塑料片(用于印刷线路板) 基材GF 玻璃基 无纺 聚四氟乙烯树脂 阻燃 微波应用 覆铜(取代MIL-P-13949/7D)(无文件)
1998-11-30
现行
MIL MIL-P-13949/14A
PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GY, GLASS BASE WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, FOR MICROWAVE APPLICATION, COPPER-CLAD (SUPERSEDING MIL-P-13949/14) (NO S/S DOCUMENT)
微波应用用覆铜层压金属覆层塑料板(用于印制线路板) 基材GY 玻璃基编织 聚四氟乙烯树脂 阻燃(取代MIL-P-13949/14)(无S/S文件)
1987-02-11
现行
MIL MIL-P-13949/7E
PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GF, GLASS BASE, NONWOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, FOR MICROWAVE APPLICATION, COPPER-CLAD (SUPERSEDING MIL-P-13949/7D) (NO S/S DOCUMENT)
微波应用用覆铜层压金属覆层塑料板(用于印制线路板) 基材GF 玻璃基 无纺布 聚四氟乙烯树脂 阻燃(代替MIL-P-13949/7D)(无S/S文件)
1987-02-11